Kabushiki Kaisha Toshiba

Akira Ushijima

Masahiro Saito

Yasunori Chiba

Hiromasa Takahashi

Emiko Ishida

Noriyuki Ooba

Toshiyuki Ono

Atsushi Matsumura

Shin Matsumoto

Kazuo Shimokawa

Takeshi Morita

Kentaro Miyazaki

Takeshi Toyoshima

Motojiro Shibata

Takahide Miyahara

Takeshi Karuishi

Takeshi Matsuura

According to one embodiment, an estimation device includes a processor. The processor accepts information. The information is acquired by each of a plurality of ultrasonic sensors transmitting an ultrasonic wave in a second direction toward a weld portion and receiving a reflected wave. The ultrasonic sensors are arranged in a first direction. The second direction crosses the first direction. The processor estimates a range of the weld portion in the second direction based on an intensity distribution of the reflected wave in the second direction. The processor calculates a centroid position of an intensity distribution of the reflected wave in the first direction for each of a plurality of points in the second direction, and estimates a range of the weld portion in the first direction based on a plurality of the centroid positions.

Estimation device, inspection system, estimation method, and storage medium

According to one embodiment, an inspection system includes a probe and a controller. The probe includes a plurality of ultrasonic sensors arranged in a first direction. The probe contacts a weld portion by moving in a second direction crossing the first direction. Each of the plurality of ultrasonic sensors transmits an ultrasonic wave toward the weld portion and receives a reflected wave. The controller detects a joint and a non-joint at a plurality of points along the first direction of the weld portion based on the plurality of reflected waves. The controller adjusts an angle of the probe around a third direction based on a number of the joints or the non-joints detected for the plurality of points. The third direction is perpendicular to the first direction and crosses the second direction.

Inspection system, control unit, control method, and storage medium

According to one embodiment, a gripping tool includes a gripper. The gripper is flexible. A granular material is provided in an interior of the gripper. The gripper is configured to grip a workpiece by being in close contact with the workpiece in a state in which an outer perimeter of the gripper is held, and by the interior of the gripper being depressurized.

Gripping tool and gripping system

A robot hand device according to an embodiment includes extensible arms which can be extended and shortened, a drive motor, and at least one clutch. The extensible arms support an object to be carried and are capable of being extended and shortened. The drive motor extends and shortens the extensible arms. The at least one clutch are capable of transmitting power of the motor to at least one of the extensible arms selected among the extensible arms to extend and shorten the selected at least one of the extensible arms.

Robot hand device and carrier apparatus using the robot hand device

According to one embodiment, an apparatus for manufacturing a display device, includes: a first holding section configured to hold a first substrate; a second holding section configured to hold a second substrate; a turning section configured to turn the first holding section such that the first substrate and the second substrate face each other; an elevation unit configured to elevate the second holding section and attach the first substrate and the second substrate via an adhesive layer; and a first radiation section configured to radiate ultraviolet rays from at least one direction of an inclined lower side of an opening of a space between the first substrate and the second substrate and an inclined upper side of the opening toward the opening.

Apparatus and method for manufacturing display device

A semiconductor-chip exfoliating device for exfoliating a semiconductor chipfrom an adhesive sheetis provided. The device includes a backup holderfor holding the adhesive sheetso that semiconductor chipsturn upward, a pair of needle pins arranged on a backside of the holderto lift off the adhesive sheetfrom the holderthrough through-holesin the holderand a sliding unitarranged on the backside of the holderto slide one needle pinin a direction to depart from the other needle pin. By the sliding unit, the interval between the needle pinscan be changed so as to cope with a variation of semiconductor chipsA.

Semiconductor-chip exfoliating device and semiconductor-device manufacturing method

A measuring device includes an actuator which holds a lens unit and moves the lens unit in the direction of the optical axis thereof. A test chart is photographed, with the lens unit being opposed to a reference image pickup device, and the lens unit is positioned at a just-focus position. The gap between the reference image pickup device and the lens unit at this time is reproduced, and an image pickup device, which is to be integrated, and the lens unit are opposed with this gap, and are fixed.

Method of manufacturing camera module

In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting includes supplying solder paste containing Au&#x2014;Sn series solder particles onto the substrate, putting the semiconductor element having a film of an Sn alloy or Sn formed on the bonding electrode on the solder paste, and melting the Au&#x2014;Sn series solder particles and the film of the Sn alloy or Sn to bond the semiconductor element to the substrate.

Growing community of inventors

Yokohama, Japan

Akira Ushijima