Mitsui Minings & Melting Co., Ltd.

Akira Uchiyama

Kiyotaka Yasuda

Yasuji Hara

Yoshiki Sakaguchi

Daisuke Mukai

Masaru Takahashi

Shingo Kikugawa

Kazuyuki Okada

There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 &#x3bc;m, and the specular gloss was made to be 250 or more when the incident angle is 60&#xb0;.

Flexible printed wiring board for chip-on flexibles

Hydrogen storage alloy and method for preparation thereof

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Ageo, Japan

Akira Uchiyama