Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Mec Company Ltd.

Akira Tsuchiko

Koji Nitta

Shoichiro Sakai

Junichi Motomura

Mitsutaka Tsubokura

Yu Fukui

Kenji Nishie

Ryuta Ohsuka

Mari Sogabe

Masashi Iwamoto

Yoshihito Yamaguchi

Masaharu Yasuda

Koji Kasuya

Kengo Goto

Yutaka Matsumura

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

Regenerating method of removal liquid and regenerated removal liquid preliminary

A printed wiring board includes a base layer having insulating properties, a first conductive layer directly or indirectly stacked on the base layer front surface, and including a copper foil, a second conductive layer directly or indirectly stacked on the base layer back surface, and including a copper foil, a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other, and having an electroless copper plating layer. Each copper foil contains a copper crystal grain oriented in a plane orientation, and an average crystal grain size of copper of each copper foil is 10 μm or greater, the electroless copper plating layer includes palladium.

Printed wiring board

In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer () is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

Method of manufacturing printed circuit board

A lead wire for a nonaqueous electrolyte battery has a conductor, and an insulating film having a plurality of layers and covering at least a part of the outer peripheral surface of the conductor, wherein the insulating film has a conductor-covering layer laminated on a surface of the conductor, a first insulating layer laminated on an outermost surface of the insulating film, and a second insulating layer laminated on an inner surface of the first insulating layer; the conductor-covering layer contains an acid-modified polyolefin; and the ratio (E1/E2) of an elastic modulus E1 of the first insulating layer at any one temperature in the range of 80° C. or more and 125° C. or less to an elastic modulus E2 of the second insulating layer at the same temperature as in the first insulating layer, is 0.10 or more and 10.00 or less.

Lead wire for nonaqueous electrolyte battery, insulating film and nonaqueous electrolyte battery

The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 μm or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 μg/cmor more and 0.40 μg/cmor less.

Printed circuit board

Growing community of inventors

Osaka, Japan

Akira Tsuchiko