Kyodo Printing Co., Ltd.

Akira Terada

Naoki Ogawa

Makoto Kato

Kenta Suzuki

Tatsuya Ogawa

Midori Kato

Yuki Narita

Shinichi Koizumi

Fumihito Kobayashi

Yoshiyuki Nakazato

Masa Inoue

Yumiko Hagio

Tomomi Karino

Yoshinori Okano

Kaori Tsunoda

Dispersion is obtained by: blending a specific resin emulsion for protecting a tungsten-based infrared-absorbing pigment; and dispersing the tungsten-based infrared-absorbing pigment in a state of being coated in advance by means of the resin emulsion.

Tungsten-based infrared-absorbing pigment dispersion, dyeing liquid, fiber product, and method for treating fiber product

The purpose of the present invention is to provide an adsorbent composition which can be easily formed into a film by inflation molding at relatively low temperatures even if zeolite is contained therein, and which is not susceptible to the formation of a pin hole. An adsorbent composition which is a resin composition containing a resin, zeolite and a metal soap, and wherein the metal soap contains a long-chain fatty acid calcium, which is a divalent salt of calcium and a long-chain fatty acid having 5-30 carbon atoms, and a long-chain fatty acid zinc, which is a divalent salt of zinc and a long-chain fatty acid having 5-30 carbon atoms.

Adsorbent composition, adsorbent-containing film and method for producing same

An absorbent film and a substrate having extremely simple production without having an adhesive layer that can generate volatile components. The absorbent laminate contains a substrate, which has an inorganic material or a low-thermal-contraction organic material, and an absorbent film on the surface of the substrate. The organic material of the substrate has a rate of thermal contraction in the direction of conveyance thereof when performing hot pressing by means of a heating roller under the conditions of 140&#xb0; C., a roller pressure of 0.1 MPa, and a conveyance speed of 0.4 m/min of less than 0.6%. The absorbent film has an absorbent layer adhered to the surface of the substrate without an adhesive layer therebetween and containing less than 87 vol % and at least 25 vol % of a thermoplastic resin binder and over 13 vol % and no greater than 75 vol % of an inorganic absorption agent.

Absorbent laminate provided with absorbent film, electronic device containing same, and method for producing same

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Tokyo, Japan

Akira Terada