Denso Corporation

Senju Metal Industry Co., Ltd.

Other

Toyota Jidosha Kabushiki Kaisha

Akira Tanahashi

Yoshitsugu Sakamoto

Chikage Noritake

Shoji Miura

Kaichi Tsuruta

Naohiko Hirano

Kimiharu Kayukawa

Takashi Ishii

Satoshi Soga

Norihisa Imaizumi

Tomomasa Yoshida

Eiichi Sudo

Seiji Shibata

Hideki Okada

A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Solder preform and a process for its manufacture

A method for manufacturing a semiconductor device having a solder layer includes the steps of: grinding a mounting surface of a semiconductor chip; etching the mounting surface of the chip; forming an electrode on the mounting surface of the chip; assembling the chip, the solder layer and a base in this order; and heating the chip, the solder layer and the base to be equal to or higher than a solidus temperature of the solder layer so that the solder layer is reflowed for soldering the chip on the base.

Method for manufacturing semiconductor device having solder layer

A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base member through the first metal layer, the first alloy layer and the tin-based solder layer in this order. The first alloy layer is made of a first metal in the first metal layer and tin in the tin-based solder layer. The first metal layer is made of at least one of material selected from the group consisting of titanium, aluminum, iron, molybdenum, chromium, vanadium and iron-nickel-chromium alloy.

Semiconductor device having tin-based solder layer and method for manufacturing the same

Soldering paste for bonding an electronic component to electrodes on a ceramic substrate includes alcohol having at least two OH groups, organic acid, and metallic powder. The electronic component disposed on the electrodes through the soldering paste undergoes a reflow performed in a nitrogen atmosphere. Accordingly, an ester film is formed around the electrodes as a reaction product of the organic acid and the alcohol. The ester film incorporates therein the remaining organic acid and metal salt as its reaction product. As a result, high insulation reliability is provided.

Soldering paste, soldering method, and surface-mounted type electronic device

Growing community of inventors

Okazaki, Japan

Akira Tanahashi