Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Agilent Technologies, Inc.

Avago Technologies Ecbu IP Pte. Ltd.

Avago Technologies Limited

Akira Takekuma

Yoshifumi Yamaoka

Shunichi Ishikawa

Sundar Natarajan Yoganandan

Chew Tong Fatt

Sumio Shimonishi

Siew Kim Tan

A light emitting diode package comprising a substrate electrically connectable to an external unit with a reduced height. A flexible PCB for electrical connection between a light emitting diode and the external unit is directly connected to a light emitting element. The direct connection is conducted by applying a conductive resin to an electrode on the flexible PCB, on which the light emitting element is mounted; mounting the light emitting element; curing the conductive resin in a high-temperature furnace. The present invention requires neither a lead frame for electrical connection of the light emitting element to the flexible PCB nor a rigid PCB for supporting the flexible PCB, thus reducing the total height of the light emitting diode package.

Light emitting diode package having flexible PCT directly connected to light source

A socket in which a light-emitting diode can be attached and detached as needed close to the structure for holding a camera module. Socket comprises a spring contact part for contacting the leads or electrodes of the light-emitting diode, and an anchor for anchoring such that the direction of a dome section has a predetermined relationship with the camera module.

Socket

A Light-emitting diode which comprises a pair of metal plate leads connected to a light-emitting element. The pair of metal plate leads comprise, at the edges of the metal plates, surface mounting-type connecting parts that connect facing the pads of a circuit substrate. Furthermore, the light-emitting diode comprises a support member that has a part, other than leads, that contacts the circuit substrate so that it can be positioned on the circuit substrate with stability during the reflow process.

Light-emitting diode and method for its production

A light-emitting device which comprises as one unit a semiconductor light-emitting element; a first liquid for condensing the light from the semiconductor light-emitting element; a second liquid that is separate from but contacts the first liquid; an airtight space in which at least first liquid and second liquid are disposed; and first and second electrodes to which voltage is applied so as to change the shape of the interface between first liquid and second liquid and adjust the condensed state of the light from semiconductor light-emitting element.

Light-emitting device and method of making same

A light emitting diode comprises light-emitting elements inside a cup structure and a lens part that condenses the light from these elements. Light-emitting element placed at the center along the optical axis of the lens emits an outgoing beam of light with a narrow directional angle along this optical axis, and light-emitting element placed away from the optical axis emits an outgoing beam of light in an oblique direction. The light-emitting elements are individually turned on and off in accordance with the distance of the subject to be photographed.

Light emitting diode and light emitting control system using same

It is to be made easy to arrange light emitting diodes, each including a lens having a hemispherical light emitting surface, and cover the base of the light emitting diodes with resin material. A light emitting diodehas a light emitting element, a lead sectionthat supplies power to the light emitting element, a basethat covers the lead section, a lenshaving a convex light emitting surface and connected to the baseto cover the light emitting element, and a step sectiondisposed such that it surrounds the outer side of the lens, part of the stephaving a different width. The step sectionhas a height that defines the amount of resin material enough to cover the lead section. There is also provided a light emitting diode display deviceusing a plurality of such light emitting diodes.

Light emitting diode with a step section between the base and the lens of the diode

In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.

Opto-electronic package, and methods and systems for making and using same

A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Light emitting diode

A light-emitting diode includes a cup component, a plurality of electrical conducting traces formed on a surface of the cup component using an MID means, a light-emitting diode chip mounted on the cup component and electrically connected to at least a first and second electrical conducting trace of the plurality of electrical conducting traces, and a first connection part connected to at least the first and second electrical conducting traces for providing electrical connections to external circuitry. The light emitting diode may also include a protective element that electrically protects the light-emitting diode chip, and the connection part may include first and second leads connected electrically to the first and second electrical conducting traces, respectively. The cup component, light emitting diode chip, protective element, leads and other components may be assembled together and molded and sealed with resin.

Light-emitting diode and a method for its manufacture

A light-emitting diode with which the LED chip will not be destroyed comprises an LED chipmounted on plate-shaped wiring meansinside a light-emitting diode. Wiring meanscomprises conductive pathsandthat electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive pathsare connected electrically to LED chip, extending from the position where the LED is mounted to leadsand, to which they are connected by soldering. LED chipis supported by being held inside concave partin one leadat this time.

Method of producing a light-emitting diode

A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip mounted on plate-shaped wiring means inside a light-emitting diode. Wiring means comprises conductive paths and that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths are connected electrically to LED chip extending from the position where the LED is mounted to leads and to which they are connected by soldering. LED chip is supported by being held inside concave part in one lead at this time.

Growing community of inventors

Tokyo, Japan

Akira Takekuma