Denso Corporation

Akira Takakura

Hiroyuki Okuhira

Hiroshi Katou

Katsuhiro Kanie

A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of &#x2212;70&#xb0; C. or more and &#x2212;40&#xb0; C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25&#xb0; C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component () comprises a sealing member () including a cured product of the curable resin composition.

Curable resin composition and electrical component using the same

A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition. 

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Nagoya, Japan

Akira Takakura