Hitachi-kokusai Electric Inc.

Akira Takahashi

Hidehiro Yanai

Masakazu Sakata

Kazuyuki Toyoda

Takeshi Yasui

Motonari Takebayashi

Kazuya Nabeta

Naoya Matsuura

Shinya Tanaka

Hiroyuki Ogawa

In the present invention, a substrate is placed at a predetermined position on a substrate support even though the substrate is deviated on a substrate transfer unit. There is provided a substrate processing apparatus that includes a process chamber, a transfer chamber accommodating a substrate transfer unit, a substrate detecting unit, a memory unit configured to store a first reference position information, a second reference position information and a substrate reference position information and a controller configured to generate a detected position information representing a position of a substrate being transferred in the transfer chamber based on a detection result and to control the substrate transfer unit to place the substrate based on the detected position information, the first reference position information, the substrate reference position information and a difference between the first reference position information and the second reference position information.

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

A substrate processing apparatus includes a first reaction chamber including: a first heating unit, a first processing space, and a first transfer space disposed under the first processing space, a second reaction chamber including: a second heating unit, a second processing space, and a second transfer space disposed under the second processing space; a first sidewall and a second sidewall defining the first reaction chamber and the second reaction chamber, wherein the first sidewall is shared by the first reaction chamber and the second reaction chamber, and a cooling channel disposed in the first sidewall and the second sidewall such that a cooling efficiency of the first sidewall is higher than that of the second sidewall, wherein the first reaction chamber and the second reaction chamber are disposed adjacent to each other with the first sidewall therebetween.

Substrate processing apparatus

A substrate processing apparatus includes a transport chamber and a processing chamber that processes substrates. The transport chamber has a first substrate transport member transporting the substrates from the transport chamber to the processing chamber. The processing chamber has a first processing unit which is adjacent to the transport chamber and has a first substrate placing base, a second processing unit which is adjacent to the other side of the transport chamber in the first processing unit and has a second substrate placing base, a second substrate transport member transporting the substrates between the first processing unit and the second processing unit, and a control unit controlling at least the second substrate transport member.

Substrate processing apparatus and substrate processing method

The present invention provides a substrate carrying mechanism, a substrate processing apparatus, and a semiconductor device manufacturing method that, when carrying a substrate, suppress the generation of scratches and particles caused by substrate deformation, suppress a decrease in substrate holding force due to substrate deformation, and realizes stable high-speed carriage. Namely, the substrate carrying mechanism, the substrate processing apparatus, and the semiconductor device manufacturing method of the present invention include: a plate-like body that becomes a support base body of a substrate that is a carrying subject; and substrate support portions in which plural convex portions disposed on a surface of the plate-like body are placed on a circumference of a circle that is smaller than the diameter of the substrate.

Substrate carrying mechanism, substrate processing apparatus, and semiconductor device manufacturing method

Provided is a substrate processing apparatus configured to attain conflicting purposes of high throughput and footprint reduction. The substrate processing apparatus comprises a carrying chamber, and a loadlock chamber and at least two process chambers that are arranged around the carrying chamber. The carrying chamber comprises a substrate carrying unit configured to carry a substrate between the loadlock chamber and the process chambers. The substrate carrying unit comprises a first arm provided with a first finger and a second finger, and leading ends of the first and second fingers extend horizontally in the same direction. Each of the process chambers comprises a first process unit and a second process unit, and the second process unit is disposed at a side of the process chamber distant from the carrying chamber with the first process unit being disposed therebetween.

A substrate processing apparatus includes a processing chamber that processes a substrate, and a substrate placing base enclosed in the processing chamber, and a substrate transporting member that allows the substrate to wait temporarily on the substrate placing base, and exhaust holes provided so as to surround the substrate placing base, and a retracting space that allows the substrate transporting member to move in between lines each connecting the exhaust hole and an upper end of the substrate placing base and the substrate placing base.

Growing community of inventors

Toyama, Japan

Akira Takahashi