Senju Metal Industry Co., Ltd.

Other

Ktt Co., Ltd.

Akira Takaguchi

Issaku Sato

Noboru Hashimoto

Junichi Okamura

Masaki Wata

Chikara Numata

Isamu Sato

Takashi Nauchi

A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Wave soldering tank

Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection headfor supplying molten solder has a nozzlebrought into contact with a mask with openings that is disposed over a substrate. After completing a supply operation, the injection headis forcedly cooled by heat transfer from a cooling unitthrough a heater unitwhose operation has been stopped. Molten solderin the cooled injection headdoes not drool from the nozzlewhen the injection headmoves up.

Solder bump forming method and apparatus

An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.

Apparatus and method of coating flux

To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. As shown in FIG., an automatic partial-jet-soldering apparatusis provided with a solder baththat has a nozzle base portionand contains molten solder, a pumpthat supplies the molten soldercontained in the solder bathunder a predetermined pressure to the nozzle base portion, plural nozzlesand the like that have predetermined solder-spouting areas and connect the nozzle base portionto spout the molten soldersupplied from the pumpunder the predetermined pressure so that it rises by its surface tension, and a dummy nozzlethat has a solder-spouting area more than that of any of the nozzlesand the like and connects the nozzle base portionto spout the molten soldersupplied from the pumpunder the predetermined pressure, wherein the dummy nozzleis positioned on a position which is nearer the pumpthan the nozzlesand the like.

Localized jet soldering device and partial jet soldering method

To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. By flowing the molten solderin the solder bathfrom inside of the inner cylinderto a nozzle cap, the inside of the nozzle capis filled with the molten solder, and the molten solderfilling the inside of the nozzle capis flown downward from between an inner cylinderand an outer cylinderwithout substantially flowing it to outside from an insert hole. This enables the molten solderto be prevented from oxidizing because the molten solderis not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzlewithout filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a leadof electronic componentbeing inserted into the insert hole, it is possible to fill the through hole of the printed circuit board P with the molten solder, so that the reliability can be improved.

Point flow soldering apparatus

A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.

Method for local application of solder to preselected areas on a printed circuit board

An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another. The conveyor system includes a frame, an arm carriage reciprocably moved along the frame, a plurality of pairs of pivot arms pivotably connected to the arm carriage and movable between an inoperative position where the pivot arms are disengaged from the boards and an operative position where the pivot arms are engaged with the boards, a pair of first rails connected to the frame and located above the flux station and the preheater station, and a pair of second rails connected to the frame and located above the wave solder station.

Growing community of inventors

Toyama, Japan

Akira Takaguchi