Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Microcomputer Engineering, Ltd.

Akira Suzuki

Kunihiko Nishi

Kunihiro Tsubosaki

Kazunari Suzuki

Aizo Kaneda

Daisuke Makino

Yoshiaki Wakashima

Nobuo Ichimura

Hideo Inayoshi

Sumumu Tuzuku

Toyoichi Ueda

In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.

Semiconductor device and process for producing the same

An apparatus for pre-heating resin tablets comprising a resin tablet heater, a switch for setting a reference softening degree and a softening degree detector for the resin tablet. The detector includes a pressure source and a pressure transmitting member coupled to the pressure source and adapted for contact with the resin tablet. The pressure transmitting member is movable a distance representative of the softening degree of the resin tablet being heated due to deformation of the resin tablet.

Apparatus for pre-heating resin tablet

Growing community of inventors

Ome, Japan

Akira Suzuki