Somar Corporation

Akira Shinozuka

Katugi Kitagawa

Yoshihiro Motoki

Yoshihisa Fujimoto

Kazufumi Ueji

A thermosetting epoxy resin based powder composition composed of an epoxy resin, a high-melting point polycarboxylic acid anhydride and calcium silicate as a filler, the high-melting point polycarboxylic acid anhydride comprising fine particles of 5 to 149 .mu.m in average size that have reacted with the epoxy resin in the molten state on their surfaces.

Powder composition of epoxy resin, high melting acid anhydride and

A method of encapsulating an article such as an electric part is disclosed which includes the steps of:

Method of encapsulating an article

An epoxy resin powder coating composition having excellent thermal resistance, mechanical strength, hardening speed and storage stability which comprises an epoxy resin mixture comprising a bisphenol type epoxy resin and a polyfunctional epoxy resin having at least three epoxy groups in the molecule; a hardener comprising a mixture of dicyandiamide and a compound represented by formula (I) below, and a filler: ##STR1## wherein, R.sup.1 represents an alkyl group or an aryl group, and preferably represents a phenyl group from the view of storage stability; and R.sup.2 represents a cyanoethyl group, a vinyl group, or a phenyl group. The powder coating composition is suitably used in fixing stator coils or armature coils in motors or generators.

Epoxy resin powder coating containing imidazole trimellitates

An epoxy resin powder coating composition comprises 100 parts by weight of bisphenol A mixed epoxy resin having number average molecular weight from 1,700 to 4,500 comprising a bisphenol A epoxy resin (A) having a number average molecular weight from 2,500 to 8,000 and a bisphenol A epoxy resin (B) having a number average molecular weight from 300 to 1,000 (C) a novolak epoxy resin 5 to 20 parts by weight of polyvinyl butyral resin or polyviny formal resin, a hardener, and a filler.

Power coating of epoxy resin mixture and polyvinyl butyral or formal

An epoxy resin composition suitable for encapsulating electric parts is disclosed which includes a mixed epoxy resin composed of a bisphenol epoxy resin and a novolac epoxy resin, and a curing agent selected from the group consisting of (a) aliphatic dicarboxylic acids of the formula:

Epoxy resin composition containing long chain aliphatic diacids and/or

An epoxy resin powder coating composition which comprises:

Epoxy resin powder coating composition

An epoxy resin powder coating composition with excellent adhesibility which comprises a bisphenol A type mixed epoxy resin having a number average molecular weight of from 800 to 2,000 comprising a mixture of a bisphenol A type epoxy resin having an average molecular weight of from 350 to 1,000 and a bisphenol A type epoxy resin having a number average molecular weight of from 2,500 to 8,000, an imidazole base compound, dicyandiamide, a pre-reacted product of an imidazole base compound with epoxy resin, and a filler.

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Chiba, Japan

Akira Shinozuka