Hitachi, Ltd.

Ihi Corporation

Tohoku University

Hitachi Video Engineering, Incorporated

Ihi Inspection and Instrumentation Co., Ltd.

Akira Sase

Tomoyuki Tobita

Yasuhiko Hara

Satoshi Shimada

Koichi Karasaki

Seiichi Ugai

Hideaki Doi

Yoshimi Yamamoto

Yasushi Shimizu

Masao Fukunaga

Keiya Saito

Soichiro Kato

Kunio Matsui

Makoto Kogure

Yutaka Sakurai

Takeo Nagata

Hisashi Nakamura

Kaoru Maruta

Noriaki Ujiie

Kenichi Aoki

Tsuyoshi Saura

Yoshikatsu Satomi, Deceased

Satoshi Shinada

The fuel physical property determination method relating to the first aspect of the present invention includes: a test fuel flame-imaging step of obtaining imaging data by imaging flames formed by supplying a pre-mixed gas containing a test fuel and an oxidant agent, to a test tube in which an internal flow path thereof has a diameter set smaller than a flame-quenching distance at normal temperature; and a physical property determination step of determining a physical property of the test fuel by comparing the imaging data obtained in the test fuel flame-imaging step and imaging data obtained by imaging flames ignited by supplying a pre-mixed gas containing a standard-mixed fuel and an oxidant agent, to the test tube, the standard-mixed fuel having a known physical property.

Fuel physical property determination method and fuel physical property determination device

A differential pressure sensor is disclosed, and in particular, there is disclosed a multiple function type differential pressure sensor capable of reducing a zero-point-change and a span change of means for detecting a differential pressure when applying a static pressure and being readily manufactured at high accuracy. The multiple function type differential pressure sensor is constructed by a semiconductor chip 1 for detecting a differential pressure, a fixing base 2 which has a joining part 21 joined to a thick part of the semiconductor chip 1 and which has a thickness less than or equal to that of the semiconductor chip 1, and also which has at least one thin part 22 in an outer periphery other than the joining part 21, and a housing 4 joined to the fixing base.

Differential pressure sensor capable of removing influence of static

In an integrated multisensor used in a differential and static pressure transmitter, a pair of static pressure gages are formed on a static pressure detecting diaphragm and another pair of static pressure gages are formed at positions on a fixed portion which are near to the center of a differential pressure detecting diaphragm. The second term generated by a differential pressure appearing in a static pressure sensor is a function of a distance. Therefore, equal influence is exerted on each static pressure gage. Accordingly, by constructing a static pressure sensor so as to form a bridge circuit, a static pressure value free of the influence of a differential pressure can be detected, thereby making it possible to determine an accurate differential and static pressure.

Integrated multisensor and static and differential pressure transmitter

There is provided a pressure measuring sensor having a diaphragm including a peripheral fixing portion so formed as to be fixed to a pressure measuring sensor proper and be thick, a pressure receiving portion responsive to a pressure to be measured to move, and a strain causing portion responsive to the movement of the pressure receiving portion to cause strain, the pressure receiving portion having a shape so formed as to substantially perform the same function as a member having a high rigidity when moving in response to a change in the above described pressure to be measured, and the strain causing portion being substantially subject to bending stress in response to the movement of the pressure receiving portion moved according to the change in the above described pressure to be measured and thereby the strain causing portion providing a plurality of gauge resistors formed on the strain causing portion with tensile stress or compressive stress proportionate to the pressure to be measured.

Pressure measuring sensor

In a communication system in which a plurality of communication units are connected to a common two-wire transmission line and signal transmission/reception is made between the communication unit and a field sensor connected to one end of the transmission line, the communication unit transmits a signal to the field sensor under the condition that no signal is present on the transmission line during a period of time not shorter than a predetermined time while the field sensor transmits a signal indicative of in-use of the transmission line at an interval of time shorter than the predetermined time during a period of time until the field sensor sends back a signal in response to the signal from the communication unit, whereby signal collision between the plurality of communication units is prevented with no provision of any specific means.

Field sensor communication method and system

A field measuring instrument such as a differential pressure/pressure transmitter, an electromagnetic flow meter, a temperature transmitter, or the like which is used for industrial measurement includes a counter which is periodically counted up at a predetermined interval and outputs an interruption signal; a work memory which can temporarily store data; an EEPROM which can store a total operating time of the field measuring instrument and a flag indicative of an abnormality; and a processing unit for receiving the interruption signal of the counter, for incrementing the total time operating times in the work memory, for storing the incremented total operating time into the EEPROM, for self-diagnosing apparatuses in the field measuring instrument and data in accordance with self-diagnosis programs provided in the processing unit, for producing a flag indicative of a state of an abnormality when the abnormality is detected, and for storing the flag into the EEPROM together with the total operating time stored in the work memory.

Field measuring instrument and its abnormality managing method

Multi-functional sensor comprises a support base made from borosilicate, a diaphragm with a E-shaped section secured to the base, the diaphragm being made from single crystalline silicon, principal plane thereof being oriented to be a crystalline plane (110), a differential pressure sensor having p-doped piezoresistor elements formed in the principal plane of the diaphragm at a thin wall portion of the E-shaped sectional diaphragm, each element being arranged along a crystal axis &lt;111&gt;, a static pressure sensor having p-doped piezoresistor elements formed in the principal plane at an outer peripheral thick wall portion of the E-shaped sectional diaphragm, each element being arranged along the crystal axis &lt;111&gt;, and a temperature sensor having a p-doped piezoresistor element formed in the principal plane at the outer peripheral thick wall portion of the E-shaped sectional diaphragm, the element being arranged along the crystal axis &lt;100&gt;. In the multi-functional sensor thus constructed, deviation of the output signal from the differential pressure sensor due to the influence of the temperature and static pressure can be removed easily to obtain the correct signal.

Multi-functional sensor

A semiconductor pressure converting device including a fixing table joined to a silicon diaphragm consists of 2 structures superposed on each other, in which the longitudinal elastic modulus of the first fixing table is significantly different from the longitudinal elastic modulus of the semiconductor diaphragm. The first fixing table is highly insulating and the linear expansion coefficient thereof is approximately equal to the linear expansion coefficient of the semiconductor diaphragm. The second fixing table is made of a material having a longitudinal elastic modulus and a linear expansion coefficient approximately equal to those of the semiconductor diaphragm.

Semiconductor pressure converting device

Disclosed is a pattern test apparatus for detecting a fault on the basis of comparison/collation between a test reference pattern and a test target pattern, the apparatus being arranged such that a picture element area is defined by a circle with a predetermined radius on a reference matter having at test reference pattern, and when the number of the picture elements located on the reference pattern is larger than the number of the picture elements located outside the reference pattern, a part of the reference pattern corresponding to a picture element located in the center of the circle is deleted. By such an arrangement, the test reference pattern can be made analogous to the real test target pattern regardless of the shape thereof, so that misjudgment of a normal test target pattern for a fault pattern can be prevented.

Pattern test apparatus

A printed wiring board circuit-pattern inspection system including a two-dimensionally movable table on which a reference printed wiring board and a printed wiring board to be inspected are placed one after another; an image pickup unit which picks up an image of a circuit-pattern on a printed wiring board by scanning the circuit-pattern in two dimensions, and converting the image into a video signal, a binary pixel forming unit which transforms the video signal into binary pattern data, synchronous signal generator which generates a synchronous signal in synchronism with the scanning operation, a first buffer memory which stores binary pattern data, compressed pattern data memory which stores compressed binary pattern data of a whole reference printed wiring board, data compander which compresses and expands binary pattern, in accordance with the synchronous signal, a second buffer memory which stores, binary pattern data compressed by the data compander and the binary data retrieved from the compressed pattern data memory, and a comparator which compares the reference binary pattern data retrieved from the first buffer memory with the binary pattern data of the board under inspection the synchronous signal thereby providing indication of a defect in the board under inspection.

Pattern inspection system

A method and an apparatus for testing the pattern of a printed circuit board, comprising a stroboscope for emitting intermittent light synchronously with the feed velocity of the printed circuit board; a condenser lens for gathering the intermittent light emitted from the stroboscope and irradiating the gathered light to the printed circuit board; a filter for converting the light of the stroboscope to exciting light; a half mirror for reflecting the exciting light gathered by the condenser lens and converted by the filter, then projecting the reflected light upon the printed circuit board perpendicularly thereto, and passing the excited fluorescent light from the substrate of the printed circuit board; an imaging lens for forming an image of the fluorescent light passed through the half mirror; another filter for eliminating any other light than the fluorescent light out of the entire light passed through the half mirror; a TV camera for picking up the fluorescent image formed by the imaging lens; a memory for storing the preceding-frame pattern video signal obtained from the TV camera with the stroboscope turned on and attenuated by an amount corresponding to the afterimage component; a circuit for subtracting the attenuated stored pattern video signal from the present-frame pattern video signal obtained from the TV camera with the stroboscope turned on; a circuit for generating a reference pattern; and a circuit for producing a negative pattern of the wiring pattern from the output signal of the subtracting circuit and comparing the negative pattern with the reference pattern. In this invention, the image of the printed circuit board set on the table in continuous motion is picked up by the TV camera without any harmful influence of the afterimage so that the printed circuit board can be properly checked to ascertain whether the wiring pattern thereof is normal or not.

Method and apparatus for testing pattern of a printed circuit board

A pattern detecting apparatus for inspecting a printed wiring board is disclosed in which a fluorescent image formed by the fluorescent light from the substrate of the printed wiring board and an image formed by the reflected light from the wiring pattern of the printed wiring board are both used because a wiring material which is left on an undesired portion of the substrate and has low reflectivity, is detected only at the fluorescent image and a defective portion of the wiring pattern where a surface layer thereof peels off, is detected only at the image formed by the reflected light, the image used for detecting the above defective portion is preferably formed by the reflected infrared light from the wiring pattern for the reason that infrared light is insensitive to a shallow flaw in the surface of the wiring pattern, and the fluorescent image and the infrared image are processed by a detection circuit, and then compared with each other to detect a pattern defect on the basis of a difference between the images thus processed.

Pattern detecting apparatus

In an apparatus for checking patterns on printed circuit boards by comparing two patterns formed on two printed circuit boards, registration patterns each including orthogonal straight line segments and respectively formed on the two printed circuit boards are imaged by two imagers, and registration images from the imagers are matched by means of a registration unit to accurately match an image of a pattern to be checked on one printed circuit board with an image of a reference pattern on the other printed circuit board.

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Katsuta, Japan

Akira Sase