Semiconductor Components Industries, LLC

On Semiconductor Trading, Ltd.

Akira Sakurai

Kiyoaki Kudo

Fumio Horiuchi

Yuhki Inagaki

Shigeaki Mashimo

Shigeki Mashimo

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. First and second transistors and first and second diodes are mounted upper surfaces of island portions of respective first and second leads, and are connected to the respective leads through wirings that connect the transistors and diodes to the bonding portions of the respective leads. Lower surfaces of the island portions are attached to an upper surface of a circuit board, and the circuit board, the transistors, the diodes, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

Method of manufacturing a circuit device

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

A circuit device comprises a circuit board and a plurality of leads each comprising an island portion, a bonding portion elevated from the island portion, and an oblique slope portion connecting the island portion and the bonding portion, and a plurality of circuit elements mounted on the island portions so as to be connected to corresponding bonding portions through wirings. Two leads are adapted to be connected to positive and negative electrodes of a direct-current power source, and yet another lead is an output lead adapted to output alternating-current power. One electrode provided on a transistor mounted on an island portion of the second input lead is connected to a bonding portion of the output lead through a wiring, and another electrode provided on a transistor mounted on an island portion of the output lead is connected to a bonding portion of the first input lead through a wiring.

Hybrid circuit device

In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.

Circuit device and method of manufacturing the same

In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.

Growing community of inventors

Tatebayashi, Japan

Akira Sakurai