Alps Electric Co., Ltd.

Akira Sakai

Hiroyuki Miyaguchi

Yasuaki Ogawa

Takejirou Takeda

Akihiro Nakamura

Yasushi Takeda

A method of manufacturing a housing for electronic parts, such as isolators, or the like, with as small non-plated portions as possible, which housing is obtained by separating a housing part from a metallic housing part support with the housing part connected to a frame through connections, the method comprising the steps of cutting off and removing the connections after provisional connections of a resin are formed on the housing part support to connect the frame to the housing part, and obtaining the housing for electronic parts by removing the provisional connections after plating is applied to surfaces of the housing part including cut portions of the connections.

Method of manufacturing a housing for electronic parts

An in-mold decorated illumination panel including an indicator sheet, an ink printed layer formed on a back surface of the indicator sheet, the ink printed layer having a printed indicator portion, and a molded layer formed on a back surface of the ink printed layer by injection molding, wherein the printed indicator portion is illuminated from the back surface of the ink printed layer to effect indication of the printed indicator portion on a front surface of the indicator sheet. An ink dissolution preventing sheet is interposed between the ink printed layer and the molded layer for preventing ink of the printed indicator portion from being dissolved away by pressure of a molding material in the injection molding. A shrinkage adjusting material for adjusting molding shrinkage of the panel is mixed in the molded layer with a predetermined content such that a shrinkage rate of the molded layer becomes substantially equal to a shrinkage rate of the indicator sheet after the injection molding, whereby warping of the panel after the injection molding is prevented.

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Miyagi-ken, Japan

Akira Sakai