Nec Corporation

Akira Ouchi

Akinobu Shibuya

Tomoo Murakami

Koichi Takemura

Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the semiconductor package includes a coplanar waveguide including a signal and ground electrodes on the mounting substrate, the signal electrode flip-chip connected to the semiconductor element, the ground electrodes arranged on both sides of the signal electrode with intervals therebetween. A step part is formed in the ground electrodes in an outer circumferential part of a mounting region of the semiconductor element, the step part having a larger distance between upper surfaces of the mounting substrate and the ground electrode in the outer circumferential part of the mounting region than such distance in the mounting region, and an insulator for covering the signal electrode in the outer circumferential part of the mounting region is formed.

Substrate for semiconductor package and method of manufacturing thereof

A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.

Semiconductor device and method for manufacturing the same

In an electronic component mounting structure, a semiconductor element (an electronic component) provided with an electrode pad and a board provide with an electrode pad corresponding to the electrode pad are connected via a conductive material portion. On a surface of the board, there is formed solder resist having an opening regulating an area of the electrode pad. The conductive material portion is formed to protrude from a surface of the solder resist. An elastic coefficient of the conductive material portion is lower than that of the solder resist. A solder bump and the conductive material portion are connected via a metal layer. The conductive material portion is formed to have an area larger than that of the opening of the solder resist. An edge of the conductive material portion is adhered to a portion of the surface of the solder resist. Thus, in a case of mounting an electronic component on a board by flip-chip connection, a reliability of connection can be secured.

Electronic component mounting structure, electronic component mounting method, and electronic component mounting board

A substrate () and a semiconductor chip () are connected by means of flip-chip interconnection. Around connecting pads () of the substrate () and input/output terminals () of the semiconductor chip (), an underfill material () is injected. The underfill material () is a composite material of filler and resin in which the maximum particle diameter of the filler is 5 &#x3bc;m or below and whose filler content is 40 to 60 wt %. Also, a first main surface of the substrate (), which is not covered with the underfill material (), and the side surfaces of the semiconductor chip () are encapsulated with a molding material (). The molding material () is a composite material of filler and resin whose filler content is over 75 wt % and in which the glass transition temperature of the resin is over 180&#xb0; C. An integrated body of the substrate () and the semiconductor chip (), which are covered with the molding material (), is thinned from above and below.

Growing community of inventors

Tokyo, Japan

Akira Ouchi