Mitsubishi Electric Corporation

Nippon Telegraph and Telephone Corporation

Kabushiki Kaisha Toshiba

International Business Machines Corporation

Sony Corporation

Tdk Electronics Company, Limited

C.uyemura Co., Ltd.

Fujitsu Takamisawa Component Limited

Kokusai Denshin Denwa Kabushiki Kaisha

Shimizu Construction Co., Ltd.

Sandisk Technologies Inc.

Spansion Llc.

Fujitsu Component Limited

Kohshin Electric Corporation

Akira Okada

Hajime Akiyama

Kinya Yamashita

Takaya Noguchi

Norihiro Takesako

Kazuto Noguchi

Takashi Sakamoto

Morito Matsuoka

Yoshihisa Sakai

Hiromasa Tanobe

Osamu Moriwaki

Masayuki Kiso

Hideki Matsunaga

Kazutoshi Kato

Sen-ichi Suzuki

Hideo Miyazawa

Yasuhiro Suzuki

Junichi Akama

Manabu Shimizu

Yasuyuki Miki

Yasuo Shibata

Satoshi Katoh

Daisuke Hashimoto

Yutaka Nakashima

Tomoji Okuda

Yasuo Kajioka

Rieko Sato

Daisuke Matsuyama

Moriyuki Ueno

Masaki Ueno

Tomio Komine

Hirofumi Yanagisawa

Kosuke Hatozaki

Yasumasa Suzaki

Keita Taniguchi

Hiroshi Tomita

Hiroyuki Nakamura

Atsushi Sakurai

Masaru Yano

Satoru Shimizu

Shu Yamamoto

Isao Suzuki

Takeshi Okuyama

Yuji Yamada

Shinichi Ogasawara

Satoshi Moriyama

Akira Ohkado

Hiroki Oka

Norio Seki

Kazuhide Kurosaki

Yasuhiko Niiro

Nobuhiro Sato

Rajdeep Gautam

Hitoshi Takimoto

Teruya Tanaka

Kahei Furusawa

Ichiroh Hino

Haruo Sakaguchi

Koichi Mochizuki

Masaru Hayashi

Yukinori Oda

Masayoshi Hirao

Miyuki Takenaka

Kazushige Matsuo

Shiro Takeno

Yoshio Mikame

Seigo Kurosaka

Mika Morita

Naoyuki Hirate

Tomoo Shokawa

Hajime Nomura

Toshio Kumagai

Mitsugu Kanetake

Akira Ohkada

Eiji Nojiri

Kazumi Okuzumi

Takayuki Shirotori

Ryoiti Aizawa

Ayumi Okubo

Junji Miyamoto

Sen-Ichi Suzuki

Kota Kitajima

A surface treatment device includes at least one paddle in a plate shape, in a surface treatment tank, for stirring a surface treatment solution near a substrate by reciprocally moving the paddle with respect to the substrate. The paddle is configured by integrally forming multiple square bars provided in a depth direction or a horizontal direction of the surface treatment solution at regular intervals along the substrate. A liquid draining member for draining a liquid is arranged in at least one side of an end of the paddle.

Turbulence-reducing device for stirring a surface treatment solution

A method for programming a target memory cell in a memory array of a non-volatile memory system, the method comprising defining a default read biasing voltage value and a default verify biasing voltage value for each program state of a target memory cell of a memory structure, determining a location of a target memory cell within the memory structure and, based upon the determined location of the target memory cell, applying a first incremental offset voltage to the default read biasing voltage value with respect to each program state, and applying a second incremental offset voltage to the default verify biasing voltage value with respect to each program state.

Read and verify methodology and structure to counter gate SiOdependence of non-volatile memory cells

The purpose of the present invention is to provide a surface treatment device and a paddle with improved strength and uniform plating thickness by uniformly stirring surface treatment solution near an object to be plated. Also, the purpose of the present invention is to provide a surface treatment method capable of stirring for a long period of time, by uniformizing plating thickness, and by improving a strength of a paddle. A surface treatment device comprising at least one plateshaped paddle, in a surface treatment tank, for stirring surface treatment solution near an object to be plated by reciprocally moving the paddle with respect to the object to be plated, wherein the paddle is configured by integrally forming a plurality of square bars provided in depth direction of the surface treatment solution in the surface treatment tank along the object to be plated at regular intervals, and a square bar of the plurality of square bars is provided with a curved surface with respect to the object to be plated in a cross section in thickness direction of the square bar.

Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereof

Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.

Evaluation apparatus of semiconductor device and method of evaluating semiconductor device using the same

An evaluation apparatus includes an insulating plate, a plurality of probes fixed to the insulating plate, an insulating portion having a connection portion connected to the insulating plate in a detachable manner and a tip portion continuous with the connection portion, the tip portion being narrower than the connection portion, an insulator formed by combining the insulating portions to surround the plurality of probes in planar view, and an evaluation unit for passing currents through the plurality of probes to evaluate electrical characteristics of an object to be measured.

Evaluation apparatus including a plurality of insulating portions surrounding a probe and semiconductor device evaluation method based thereon

An evaluation apparatus for a semiconductor device includes: a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; and a plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from the surface of the chuck stage, and come into contact with an arrangement surface of the semiconductor device arranged in the chuck stage, wherein a height protruding from the surface of the chuck stage of at least one of the in-chuck probes is different from a height protruding from the surface of the chuck stage of the other in-chuck probe.

Evaluation apparatus for semiconductor device and evaluation method for semiconductor device

Provided is a technique capable of preventing occurrence of partial discharge. An evaluation apparatus includes a probe disposed on an undersurface of an upper component; a sidewall part disposed on the undersurface of the upper component and enclosing sides of the probe; and a first gas supplying part. The first gas supplying part is capable of supplying a gas to a to-be-measured object that is placed on a stage when the sidewall part comes in proximity to the stage, and to a space enclosed by the stage, the sidewall part, and the upper component when the sidewall part is in contact with the stage.

Evaluation apparatus and evaluation method

Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.

Device and method for inspecting position of probe, and semiconductor evaluation apparatus

A purpose of the present invention is to provide a technique capable of suppressing an electric discharge during evaluation. A semiconductor device includes: a semiconductor base body having an element region and a terminal region; a plurality of electrode pads disposed in an area that is in the element region of the semiconductor base body and is separated from the terminal region, an insulating protection film having an opening provided above each of the electrode pads; and a plurality of conductive layers disposed on the protection film and electrically connected to the plurality of electrode pads, respectively, through the opening. In a planar view, each of the conductive layers is extended to the terminal region or the vicinity of the terminal region.

Semiconductor device and method for testing same

A wound wire is wound around a core assembly so that both ends are short-circuited. In a coupling pin insertion state in which a coupling pin is inserted in a through hole of the core assembly, outer-peripheral space parts of respective divided core portions of the core assembly are disposed so as to overlap in plan view. Consequently, an air gap is formed in a part of a side surface of the core assembly. Before formation of a covering member, a main wire is caused to pass through the air gap and is thus disposed in a wiring hole of the core assembly. Then, the covering member for closing the air gap is provided on an outer peripheral surface side of the core assembly including the air gap so that a core structure is obtained.

Wiring core structure, semiconductor evaluation device and semiconductor device

A probe position inspection apparatus capable of inspecting the position of contact portions of respective probe tips easily and accurately, an apparatus for inspecting a semiconductor device, and a method of inspecting a semiconductor device are provided. The probe position inspection apparatus includes a transparent plate, a camera for taking an image of one surface of the transparent plate, and a pressure passive member covering the other surface of the transparent plate. The tip of a probe for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate, with the pressure passive member therebetween. The probe position inspection apparatus further includes an image processor for processing the image taken by the camera to detect the position of the probe in the plane of the transparent plate.

Probe position inspection apparatus, semiconductor device inspection apparatus and semiconductor device inspection method

A purpose of the present invention is to provide a semiconductor device that can restrain occurrence of partial discharge in evaluation of electric characteristics and can carry out failure analysis from the upper side of a measurement object. A semiconductor device according to the present invention includes: at least one electrode; a protective layer having at least one opening part provided such that a portion of the electrode is exposed at the opening part, and being formed to cover the other portion of the electrode excluding the portion of the electrode exposed at the opening part, the protective layer being insulative; and a conductive layer formed so as to cover the protective layer and the opening part and be directly connected to the electrode at the opening part.

Semiconductor device and electrical contact structure thereof

A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.

Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation method

An apparatus for evaluating a semiconductor device includes: a chuck stage for fixing a semiconductor device; an insulating substrate; a plurality of probes fixed to the insulating substrate; a temperature adjustment unit adjusting temperatures of the plurality of probes; an evaluation/control unit causing a current to flow into the semiconductor device through the plurality of probes to evaluate an electric characteristic of the semiconductor device; an inspection plate having a front surface and a rear surface opposite to each other; a thermal image measurement unit acquiring a thermal image of the inspection plate when distal end portions of the plurality of probes are pressed against the front surface; and a thermal image processing unit performing image processing to the thermal image to obtain in-plane positions and temperatures of the distal end portions of the plurality of probes.

Apparatus and method for evaluating semiconductor device comprising thermal image processing

An apparatus for evaluating a semiconductor device includes: a chuck stage; an insulating substrate; a plurality of probes; a temperature adjustment unit; an evaluation/control unit; and a probe position/temperature inspection device including an inspection plate, a thermo-chromic material, a photographing unit, and an image processing unit. The photographing unit photographs a color-change image of the thermo-chromic material in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate. The image processing unit performs image processing to the color-change image to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes.

Apparatus and method for evaluating semiconductor device

Growing community of inventors

Tokyo, Japan

Akira Okada