Murata Manufacturing Co., Ltd.

Akira Ohtani

Kunihiko Hamada

Masaki Fujiyama

Yuji Ukuma

For mounting on a substrate by using an electroconductive adhesive, an electroconductive paste for forming an external electrode which has improved moisture resistance and which is resistant to occurrence of external-electrode peeling, as well as a ceramic electronic component including the electroconductive paste are provided. The electroconductive paste includes a base-metal electroconductive powder, first glass frit, and an organic vehicle, wherein the first glass frit has a BOcontent of 10 to 20 percent by mole, a SiOcontent of 50 to 65 percent by mole, an alkali metal oxide content of 10 to 20 percent by mole, a ZnO content of 1 to 5 percent by mole, a TiOcontent of 1 to 5 percent by mole, a ZrOcontent of 1 to 5 percent by mole, and an AlOcontent of 1 to 5 percent by mole.

Electroconductive paste and ceramic electronic component including electroconductive paste

Provided is a conductive paste, including a metal powder, glass frit and SiO,dispersed in an organic vehicle in which the compounding ratio of SiO,is in the range of 0.3 to 1.5% by weight. The conductive paste can prevent scattering of a solder plating film formed on a thick film electrode during surface mounting of a ceramic electronic part including a thick film electrode (an external electrode) which is formed by coating the ceramic electronic part with the conductive paste and baking.

Conductive paste and ceramic electronic part including the same

Disclosed is an electroconductive paste and a laminated ceramic electronic part produced by the use of the paste. The part exhibits improved heat-shock resistance during surface mounting thereof. The paste comprises a metal component and glass frit dispersed in an organic vehicle, and the glass frit comprises a zinc borosilicate containing CaO. The proportion of CaO to the total weight of the glass frit is preferably about 3 to 15 wt. %. The laminated ceramic electronic part comprises outer electrodes formed on the sides of the body of the part by baking the paste thereon.

Electroconductive paste and laminated ceramic electric part

A conductive paste which can control formation of a reaction layer and allow large flexibility measurements, and external electrodes for an electronic product formed using this conductive paste are provided. The conductive paste is prepared by dispersing a metal powder and glass frit in an organic vehicle, and the glass frit is a mixture of a zinc group frit and a lead group frit, the percentage of zinc group frit being within a range of from about 20 to 80 wt %, while the lead group frit is the remainder.

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Yasu, Japan

Akira Ohtani