Ebara Corporation

Ntt Docomo, Inc.

Mcafee, Inc.

Akira Ogata

Hirokuni Hiyama

Yutaka Wada

Tamami Takahashi

Seiji Ishikawa

Masayoshi Hirose

Yoshimi Sasaki

Kenichi Suzuki

Akihisa Hongo

Mitsuo Tada

Satoshi Sendai

Atsushi Chono

Koji Mishima

Hiroaki Inoue

Kensaku Mori

Katsuhide Watanabe

Seiji Katsuoka

Victor Kouznetsov

Toshio Yokoyama

Masahiko Sekimoto

Junichiro Yoshioka

Davide Libenzi

Yoshitaka Mukaiyama

Michael C Pak

Koichi Asano

Kenya Tomioka

Naomitsu Ozawa

Fumihiko Sakata

Katsuaki Yoshizawa

A system, method, and computer program product are provided for initiating a security action at an intermediate layer coupled between a library and an application. In use, a library of data is stored. Additionally, system calls intended for operating on the data are produced, utilizing an application. Furthermore, the system calls are intercepted and a security action is initiated on the data in response to the interception, utilizing an intermediate layer between the library and the application.

System, method, and computer program product for initiating a security action at an intermediate layer coupled between a library and an application

A workpiece is processed uniformly, e.g., a uniform plated film is formed on a workpiece, by a processing liquid, e.g., a plating solution, which is maintained in an optimum state while minimizing the amount of the processing liquid to be used. An apparatus for processing the workpiece has a plurality of solution supply tanksfor individually holding a plurality of solutions, respectively, to be mixed into a processing liquidwhile managing the temperatures of the solutions, a plurality of mixing tanksfor mixing the solutions individually supplied from the solution supply tanksinto the processing liquidwhile managing the temperatures of the solutions, and a processing bathfor introducing the processing liquidtherein and processing the workpiece, e.g., a substrate W, by bringing the workpiece into contact with the processing liquidwhile managing the temperature of the processing liquid

Apparatus for and method of processing substrate

A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.

Polishing apparatus including turntable with polishing surface of different heights

The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.

Plating device

The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.

Plating apparatus for detecting the conductivity between plating contacts on a substrate

A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

Polishing apparatus including turntable with polishing surface of

A polisher provided with a vibration detection system which can detect vibration caused by rubbing between an article to be polished and a polishing member without any noise which is generated in prior art polishers. The polisher includes a turntable assembly with a polishing surface, a rotatable carrier assembly for holding an article to be polished in such a manner that the article is kept in contact, under pressure with the polishing member while being polished. A vibration detector is provided on the rotatable carrier assembly in order to detect the vibration caused by the rubbing between the article and the polishing member of the turntable assembly. A light signal emission device is provided on the rotatable carrier assembly and is adapted to receive electrical signals transmitted from the vibration detector to generate and emit light signals in response to the vibration detected by the detector. A light signal receiving device is provided on a stationary part of the polisher. The light emission device may be an infrared light emission device.

System for detecting the endpoint of the polishing of a semiconductor

A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

Growing community of inventors

Tokyo, Japan

Akira Ogata