Tokyo Electron Limited

Akira Obi

Seiichi Kaise

Shigeaki Kato

Hiroshi Nakamura

Takeshi Yokouchi

Noriyuki Iwabuchi

Akira Iwami

Hisato Tanaka

Kazushi Tahara

Keiko Takahashi

Mariko Shibata

Michishige Saito

Ryoichi Yoshida

Kiyohito Iijima

Tetsuo Yoshida

Toshikatsu Wakaki

Hiroshi Suzuki

Kiyohito Iljima

Hayato Aoyama

A plasma etching method by using a plasma etching apparatus having a depressurizable processing chamber; a lower electrode for mounting thereon a substrate to be processed in the processing chamber; an upper electrode facing the lower electrode in the processing chamber with a plasma generation region formed therebetween; a radio frequency power supply unit for applying a radio frequency power between the upper electrode and the lower electrode to thereby form a radio frequency electric field in the plasma generation region, the method comprising: supplying a first gas including etchant gas to an upper gas inlet to introduce the first gas through the upper electrode into the plasma generation region; and feeding a second gas including dilution gas to a side gas inlet to introduce the second gas through a sidewall of the processing chamber into the plasma generation region.

Plasma etching method

A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.

Substrate processing method, system and program

According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S). If it is judged through the diagnosis performed in Sthat no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S). If the processing has been completed, the processing apparatus is stopped (S). If, on the other hand, it is judged through the diagnosis performed in Sthat an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S). The processing apparatus is then stopped (S).

Method of maintaining and automatically inspecting processing apparatus

At a time Tp when a wafer W is transferred into either a load lock chamber LLor LL, periods PSL for the load lock chambers LLand LLto get ready to permit a transfer of a next wafer W thereinto are calculated based on a timing for exchange of wafers W between the load lock chamber LLor LLand a loader module LM. When the periods PSL are calculated, a loader arm LAor LAselects a next wafer W having the shortest period to get ready to be transferable into the load lock chamber LLor LL, from load ports LPto LP. This improves transfer delay in a cluster tool provided with the load lock chambers.

Cluster tool and transfer control method

A method of inspecting a substrate processing apparatus that enables a reduction in operator labor time to be achieved. A host computer instructs a substrate processing apparatus to prohibit transfer of a product wafer into the substrate processing apparatus during a period of cleaning the substrate processing apparatus. The substrate processing apparatus notifies the host computer of a number and types of inspection wafers to be used in inspections for predetermined inspection items. The host computer notifies the substrate processing apparatus that preparation of the inspection wafers has been completed.

Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method

Cluster tool and method for controlling transport

Method of automatically resetting processing apparatus

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Nirasaki, Japan

Akira Obi