Screen Holdings Co., Ltd.

Akira Oato

Takayoshi Tanaka

Tomomi Iwata

Tetsuya Emoto

Atsuro Eitoku

Yuya Tsuchihashi

Takashi Akiyama

Yuta Nakano

Reo Tamura

Teppei Nakano

A liquid of a hydrophobizing agent is supplied to a surface of a substrate to form a liquid film of the hydrophobizing agent that covers an entire surface region of the substrate. Thereafter, a liquid amount of the hydrophobizing agent on the substrate is decreased while maintaining a state in which the entire surface region of the substrate is covered with the liquid film of the hydrophobizing agent. Thereafter, the liquid of the hydrophobizing agent on the substrate is replaced with a liquid of the first organic solvent by supplying the liquid of the first organic solvent to the surface of the substrate covered with the liquid film of the hydrophobizing agent in a state in which the liquid amount of the hydrophobizing agent on the substrate has decreased. Thereafter, the substrate is dried.

Method of processing substrate and substrate processing apparatus

A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.

Substrate processing method and substrate processing apparatus

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Kyoto, Japan

Akira Oato