Matsushita Electric Industrial Co., Ltd.

Akira Noudo

Shozo Fukuda

Shigeki Imafuku

Junichi Hada

Eiichi Hachiya

Yoshiyuki Hattori

Atsushi Tanabe

Masamichi Morimoto

Kimiaki Sano

Iwao Kanetaka

An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Apparatus for mounting components on substrate

Apparatus and method for mounting components on substrate

Adjustment of image pickup conditions through alternative selection of two cameras different in resolution, adjustment of image lightness of a to-be-recognized component based on component information of the component, and performing control allows an image of the component to be picked up by either one of the cameras under the image pickup conditions.

Method and apparatus for component recognition

A component recognizing method, and an apparatus for executing the method, for applying light to leads on a mounting surface of an electronic component and executing positional detection of the leads by a height detecting section, comprising a 3-D sensor, on the basis of light reflected from the leads. The method includes limiting a region to be measured by the height detection section so that light reflected from objects behind or near the leads is excluded from the region and processing light reflected from the region, thereby removing the reflected light from objects behind or near the lead.

Component recognizing method and apparatus

An electronic component mounting device permits recognition of an electronic component for precise mounting. A recognizing device includes a line camera having a one-dimensional CCD array, a shutter camera having a shutter function, and a device for selecting either the line camera or the shutter camera depending on the size or shape of the electronic components. The electronic components are recognized by image data obtained by a selected one of the cameras while the electronic component is moving along a movement path of a mounting head towards a mounting location.

Electronic component mounting apparatus

Growing community of inventors

Yamanashi-ken, Japan

Akira Noudo