Ebara Corporation

Sony Corporation

Mitsubishi Electric Corporation

Riso Kagaku Corporation

Canon Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Tdk Corporation

Ricoh Company, Ltd.

Mitsumi Electric Company Ltd.

Toray Industries, Inc.

Nippon Hoso' Kyokai

Oji Paper Co., Ltd.

Nec Corporation

Sony Group Corporation

Senju Pharmaceutical Co., Ltd.

Akira Nakamura

Kazutaka Ikeda

Keiichi Fukuda

Yoshihiro Hayashi

Taro Takahashi

Hiroyuki Shinozaki

Tomoatsu Ishibashi

Makoto Kobayashi

Akihiro Kojima

Makiko Yamamoto

Koji Yamanaka

Toshihiro Uehara

Satoru Taniguchi

Xun Xu

Kenji Machida

Takahiro Ogawa

Mitsuo Tada

Yoshinori Sato

Shuhei Yamamoto

Shuichi Kikuchi

Hiroshi Inoue

Ryoji Ikegaya

Hiroshi Ota

Masataka Nakamura

Peng Ji

Toshihiro Fukuda

Yuta Suzuki

Katsuhisa Ito

Takayuki Yanagisawa

Katsuhide Watanabe

Naoki Ide

Hisanori Matsuo

Toshio Okamoto

Keiichi Yano

Isao Abe

Yoshinori Yamaguchi

Makoto Yamaguchi

Tsutomu Itoh

Shigemitsu Tomaki

Izushi Kobayashi

Toshio Sakurai

Yoshihiko Tanaka

Toru Yoshida

Satoshi Takeda

Toshiyuki Hiroi

Keita Yagi

Yoshiyuki Tsuda

Takuya Fujita

Taku Naitou

Motoaki Tamaya

Shinichi Oe

Chise Nanba

Koichi Fukaya

Masami Takai

Akira Imamura

Hiroyuki Fujii

Hiroaki Shibue

Takahiro Shimano

Junji Numazawa

Shinji Kajita

Naoto Hayashi

Hitoshi Takada

Yasuhiko Shinjo

Masamitsu Okamura

Yoshitomo Onoda

Kenichi Sugita

Kiyoshi Hattori

Hiroyuki Fukuhara

Rumiko Kitagawa

Yoichi Shiokawa

Tsuneo Torikoshi

Taro Miura

Junichi Aizawa

Yasumasa Hiroo

Hideo Nagasaka

Koji Funaoka

Shinya Nakai

Tadashi Narabayashi

Tsutomu Fukushima

Atsuo Minato

Takuya Narihira

Hidetaka Nakao

Osamu Hirose

Hiroshi Saitoh

Haruo Tateno

Kazunari Kimura

Nobuhiko Tanaka

Nobumasa Seiyama

Tomoaki Kawata

Tohru Takagi

Takeshi Nishioka

Hiroshi Miyano

Norifumi Yamamoto

Yuichi Nakano

Yutaka Sugawara

Kenji Yabe

Katsumi Yamada

Koji Okajima

Takuya Ogura

Provided is a production apparatus of a non-aqueous electrolyte solution that can produce conveniently and at a low cost the non-aqueous electrolyte solution while readily controlling an acidic impurity concentration so as to be in a prescribed level. The production apparatus of the non-aqueous electrolyte solution includes an original liquid tank that stores a liquid to be processed containing a non-aqueous electrolyte solution, and an ion-exchange resin container that accommodates a weakly basic anion-exchange resin, and also including a liquid circulation pipe that returns the liquid to be processed that is obtained after flowing the liquid to be processed from the original liquid tank through the ion-exchange resin container to the original liquid tank.

Production method of non-aqueous electrolyte solution

The apparatus for producing a non-aqueous electrolytic solution includes: a moisture adsorption apparatus accommodating zeolite through which an organic non-aqueous solvent passes, an electrolyte addition apparatus for adding an alkali metal salt electrolyte to the organic non-aqueous solvent treated by the moisture adsorption apparatus, and an acid adsorption apparatus accommodating a weakly basic anion exchange resin through which an alkali metal salt electrolyte-containing solution obtained by the electrolyte addition apparatus passes.

Apparatus for producing non-aqueous electrolytic solution and method for producing non-aqueous electrolytic solution

Provided is an apparatus for producing a non-aqueous electrolytic solution capable of easily performing purification treatment by removal of acidic impurities such as hydrogen fluoride contained in a non-aqueous electrolytic solution. The apparatus for producing a non-aqueous electrolytic solution comprises an ion exchange unit accommodating a weakly basic anion exchange resin through which an alkali metal salt electrolyte-containing solution having the alkali metal salt electrolyte dispersed in an carbonate ester is passed to obtain the non-aqueous electrolytic solution, wherein the weakly basic anion exchange resin has a styrene-based resin as substrate and an amino group as weakly basic anion exchange group.

An apparatus for pretreating an ion exchange resin includes at least a stock solution tank for storing a non-aqueous solvent, an ion exchange resin container accommodating an ion exchange resin, and a moisture removal apparatus for removing moisture in the non-aqueous solvent, and at least one solution feed pipe selected from: a circulating solution feed pipe for returning, to the stock solution tank, the non-aqueous solvent that has passed through the ion exchange resin container and the moisture removal apparatus in this order from the stock solution tank; and a circulating solution feed pipe for returning, to the stock solution tank, the non-aqueous solvent that has passed through the moisture removal apparatus and the ion exchange resin container in this order from the stock solution tank.

Apparatus for pretreating ion exchange resin and method for pretreating ion exchange resin

A conveyance abnormality prediction system includes an estimation unit that has a learned model having machine learned a relationship between a data set including sensor data outputted, at a time of substrate transport in the past, from each of a plurality of sensors provided on a substrate transport unit and a degree of conveyance abnormality at the time of the substrate transport, estimates a degree of conveyance abnormality at a time of new substrate transport by using, as an input, a data set including sensor data outputted from each of the plurality of sensors at the time of the new substrate transport, and outputs the estimated degree of conveyance abnormality.

Conveyance abnormality prediction system

A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal. The bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

Laminated electronic component with differing glass content electrodes

A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached thereto; and a processor configured to generate the feature amount from the signal regarding the frictional force between the polishing member and the substrate in polishing or the feature amount from the temperature of the polishing member or a target substrate in polishing, and output the data regarding the film thickness of the polished substrate or any of the parameters related to the yield of the product included in the polished substrate, as an estimated value, by inputting the generated feature amount to the learned machine learning model.

Polishing apparatus, information processing system, polishing method, and computer-readable storage medium

An information processing apparatus has a plurality of communication units capable of communicating with an image processing apparatus. The information processing apparatus obtains information of an image processing apparatus connected via at least one communication unit of the plurality of communication units and is not connected to the Internet, and it determines whether it is necessary to connect the image processing apparatus to a predetermined network connected to the Internet based on the obtained information. In a case where it is determined that it is necessary to connect, the information processing apparatus causes the image processing apparatus to execute processing for connecting to the predetermined network via the at least one communication unit, and in a case that the processing for connecting completes, registers the image processing apparatus to a service intermediated by the predetermined network.

Information processing apparatus, information processing system, method of controlling the information processing apparatus, and storage medium for connecting to predetermined network

To measure thickness in a polishing treatment more efficiently. A substrate polishing apparatus comprises a rotatably configured polishing table provided with a sensor that outputs a signal related to a thickness, a rotatably configured polishing head that faces the polishing table, a substrate being attachable to a face of the polishing head that faces the polishing table, and a controller. The controller acquires a signal from the sensor when the sensor passes over a surface to be polished of the substrate, specifies an orbit of the sensor with respect to the substrate on a basis of a profile of the signal, calculates a thickness of the substrate at each point on the orbit on a basis of the signal, and creates a thickness map on a basis of the calculated thickness at each point on a plurality of orbits of the sensor.

Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate

An output of an eddy current sensor includes an impedance component. A film thickness measuring apparatus obtains film thickness information from the impedance component. Using a non-linear function between the film thickness information and the film thickness, the film thickness is obtained from the film thickness information. When a resistance component and a reactance component of the impedance component are associated with respective axes of a coordinate system having two orthogonal coordinate axes, the film thickness information is a reciprocal of a tangent of an impedance angle which is an angle formed by a straight line connecting a point on the coordinate system corresponding to the impedance component and a predetermined reference point, and a predetermined straight line.

Polishing apparatus and calibration method

A novel polishing apparatus which determines a polishing end point of a substrate on the basis of a strain of a constituent element of the polishing apparatus caused by friction between a substrate such as a wafer and a polishing pad. The polishing apparatus includes a rotatable polishing table which supports a polishing pad, a polishing head which presses the substrate against the polishing pad, a rotating shaft connected to the polishing head, a support structure which rotatably supports the rotating shaft, a strain measuring instrument which measures a strain of the support structure, and an end point detector which determines a polishing end point of the substrate on the basis of a change in the strain. The strain measuring instrument includes at least one strain sensor fixed to the support structure.

Polishing apparatus and polishing method

A method for an information processing apparatus, comprising: acquiring first information to be used to establish connection to a connection target access point and second information concerning a communication apparatus to be connected to the access point by imaging a first image displayed on a display unit of another information processing apparatus connected to the access point; establishing wireless connection to the communication apparatus based on the second information acquired in the acquiring the first information; and transmitting the first information to the communication apparatus to cause the communication apparatus to try connection to the access point.

Method for information processing apparatus, information processing apparatus, and method for communication system

An information processing apparatus for communicating with a printing apparatus includes a generation unit configured to generate, when communication with the printing apparatus using first port setting information in a print queue for the printing apparatus is disabled, second port setting information that is different from the first port setting information and that enables communication with the printing apparatus, the generation of the second port setting information being based on information acquired from the printing apparatus; and a change unit configured to change port setting information in the print queue from the first port setting information to the second port setting information. In response to an Internet Protocol (IP) address of the printing apparatus being changed after generation of the second port setting information, the information processing apparatus is able to use the second port setting information to communicate with the printing apparatus by automatically using the changed IP address.

Information processing apparatus, control method, and non-transitory computer-readable storage medium storing program

To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.

Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program

A polishing device includes a polishing table comprising a polishing surface, a top ring configured to press a polishing target surface against the polishing surface and comprising a plurality of pressing portions configured to independently apply a pressing force to a plurality of areas of the wafer, and a controller configured to store a first pressing portion effect rate for a first pressing portion of the plurality of pressing portions in a storage unit, the first pressing portion effect rate being a change in polishing amount of the polishing target surface for a change in pressing force applied by the first pressing portion and control the pressing force applied by the first pressing portion based on the first pressing portion effect rate and a polishing profile of the polishing target surface.

Polishing device, polishing method, and non-transitory computer readable medium

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Tokyo, Japan

Akira Nakamura