Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Renesas Technology Corp.

Nippon Telegraph and Telephone Corporation

Other

Showa Denko Materials Co., Ltd.

Rohm Co., Ltd.

Pioneer Corporation

Mitsubishi Chemical Corporation

Hitachi Cable, Inc.

Central Glass Company, Limited

Kyoto University

Kokusai Denshin Denwa Kabushiki Kaisha

Hitachi Ulsi Systems Co., Ltd.

Resonac Corporation

Akira Nagai

Akio Takahashi

Masahiko Ogino

Shuji Eguchi

Asao Nishimura

Ichiro Anjoh

Takumi Ueno

Toshiya Satoh

Haruo Akahoshi

Toshikazu Narahara

Hiroyoshi Kokaku

Junichi Katagiri

Toshiaki Ishii

Masanori Segawa

Ichiro Anjo

Chuichi Miyazaki

Itsuo Watanabe

Motoyo Wajima

Mamoru Mita

Katuo Sugawara

Kazuyoshi Kojima

Osamu Watanabe

Masahiro Ono

Kenzo Takemura

Hideki Tanaka

Kunihiro Tsubosaki

Takao Miwa

Satoru Amou

Kazutaka Honda

Makoto Kitano

Naotaka Tanaka

Nobutake Tsuyuno

Masahiro Suzuki

Akihiro Yaguchi

Shin Nishimura

Shinji Yamada

Norio Okabe

Akio Mukoh

Yukiharu Akiyama

Tomoaki Kudaishi

Tsuyoshi Morimoto

Tadanori Segawa

Hiroshi Koyama

Makoto Satou

Ryuji Kohno

Takao Ishikawa

Kazuhiro Suzuki

Masao Suzuki

Teiichi Inada

Kazunori Yamamoto

Makoto Morishima

Tetsuo Kumazawa

Masanori Shibamoto

Masaaki Yasuda

Toshiaki Tanaka

Yuichi Satsu

Yoshitaka Takezawa

Tetsutaro Kobayashi

Takashi Kurihara

Masatsugu Ogata

Naoyuki Urasaki

Toshiyuki Miyadera

Hiroyuki Yano

Ryo Hiraga

Tohru Maruno

Kanako Yuasa

Tetsuya Enomoto

Keishin Handa

Hayato Kotani

Hiroshi Nakano

Kunihiko Nishi

Akio Hasebe

Masaharu Kubo

Satoshi Nakamura

Hiromi Abe

Masami Yusa

Hitoshi Akamine

Fumiyuki Kobayashi

Fumio Inoue

Akishi Nakaso

Ryosuke Kimoto

Kanji Murakami

Go Yamamoto

Hitoshi Fuji

Shigeo Amagi

Atsushi Fujita

Yoshiyuki Tsuru

Masayuki Noda

Yasushi Shimada

Yoshihiro Ejiri

Tomohisa Ohta

Yoshiaki Tsubomatsu

Aizou Kaneda

Yasuhiko Niiro

Ken Nanaumi

Koutarou Suzuki

Toshio Yamazaki

Masamichi Maruta

Masatoshi Sugimasa

Kenya Kawano

An authentication-permission system includes devices, and a server to generate a private key for each device, and to deliver an extension identifier including an identifier to identify the device and permission information on the device. The server holds the identifier and the permission information on the device; generates the private key for the device from the extension identifier that includes the identifier to identify the device and the permission information; and delivers the generated private key, and the extension identifier to the device. The device executes mutual authentication with another device, by using the extension identifier and the private key of the device, and permits the other device a request to the device, in accordance with the permission information included in the extension identifier of the other device, in response to successful execution of the mutual authentication with the other device.

Authentication-permission system, information processing apparatus, equipment, authentication-permission method and program

A terminal for performing authentication through TLS 1.3 with a server connected via a communication network. The terminal includes a memory and a processor configured to execute transmitting, to the server, a ClientHello message including a first identifier and a first short-term public key, which are needed to generate a shared key for encrypting a message during a handshake in the TLS 1.3, through key exchange with mutual authentication using ID-based encryption; receiving, from the server, a ServerHello message including a second identifier and a second short-term public key, which are needed to generate the shared key; and generating the shared key using the first identifier, the first short-term public key, the second identifier, and the second short-term public key.

Terminal, server, method and program

An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2):

Acrylic resin, producing method thereof, resin composition set, heat storage material, and article

A key exchange system, for generating a shared key for performing encrypted communication between multiple communication devices, includes the multiple communication devices. Each of the multiple communication devices includes a memory, and a processor configured to generate a short term private key by using a private key, generate a short term public key on one of asymmetric pairing groups used for the ID based encryption, by using the short term private key, and generate a shared key for performing encrypted communication with another communication device by performing a first pairing operation using a private key generated on another one of the asymmetric pairing groups and a short term public key generated in the other communication device, and performing a second pairing operation using the short term private key of the communication device and public information used in generating a private key of the other communication device.

Key exchange system, method and program for generating a shared key for secure communication

A key exchange system in which a shared key is generated for executing encrypted communication between communication apparatuses according to an authenticated key exchange protocol using ID-based encryption, wherein each communication apparatus includes a memory and a processor configured to generate a short-term private key by using a private key of the communication apparatus; generate a short-term public key of the communication apparatus by using the short-term private key; generate private information on the communication apparatus by using the short-term private key, a short-term public key generated by another communication apparatus, and public information generated by the communication apparatus and said another communication apparatus or public information generated by a key delivering center; and generate the shared key for executing encrypted communication with said another communication apparatus by executing a pairing operation using the private key of the communication apparatus and the private information.

Key exchange system, communication apparatus, key exchange method and program

A key sharing system that generates a shared key that is used to perform encrypted communication between a first device and a second device according to an authenticated key sharing protocol, at least one device of the first device and the second device including: calculation means for calculating a shared value &#x3c3;of shared values &#x3c3;(i=1, . . . , n) that are used to generate the shared key, the shared value &#x3c3;being calculated through pairing computation, using a private key Das an input; entrusting means for entrusting an information processing apparatus that is connected to the device via a network, with calculation of a shared value &#x3c3;(k&#x2260;j) of the shared values &#x3c3;(i=1, . . . , n), the shared value &#x3c3;being calculated through pairing computation, using a private key Das an input; and key generation means for generating the shared key, using the shared value &#x3c3;calculated by the calculation means and the shared value &#x3c3;calculated by the information processing apparatus.

Shared key system, information processing apparatus, equipment, shared key method and program

Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Adhesive for semiconductor device, and high productivity method for manufacturing said device

In one aspect, the present invention provides a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, and a straight-chain saturated hydrocarbon compound.

Resin member and sheet using same, and heat storage material and heat control sheet using same

In one aspect, the present invention is a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, a straight-chain saturated hydrocarbon compound, and a gelling agent.

Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using same

An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein Rrepresents a hydrogen atom or a methyl group, and Rrepresents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.

Resin composition, heat storage material, and commodity

A client apparatus converts second input authentication information having a data content compliant with a second authentication method different from a first authentication method into authentication target information in a data format compliant with the first authentication method and transmits information corresponding to the authentication target information to a communication server apparatus. A server apparatus is capable of carrying out both a first process of providing a first authentication server apparatus that carries out an authentication process compliant with the first authentication method with first information corresponding to the authentication target information and a second process of providing a second authentication server apparatus that carries out an authentication process compliant with the second authentication method with second information corresponding to the authentication target information. The server apparatus transmits authentication result information based on at least one of a result of the authentication performed by the first authentication server apparatus based on the first information and a result of the authentication performed by the second authentication server apparatus based on the second information to the communication server apparatus.

Authentication control system, server apparatus, client apparatus, authentication control method, authentication method, and program

There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal. The above described method comprises: (a) a first step of press-bonding the semiconductor chip and the wiring circuit board or the semiconductor chips to each other so that the respective connection portions are in contact with each other with a semiconductor adhesive interposed therebetween, at a temperature lower than a melting point of the metal of the connection portion, to obtain a temporarily connected body; (b) a second step of sealing at least a part of the temporarily connected body with a sealing resin to obtain a sealed temporarily connected body; and (c) a third step of heating the sealed temporarily connected body at a temperature equal to or higher than the melting point of the metal of the connection portion, to obtain a sealed connected body.

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer

A random number generating unit generates random numbers s, s, s', and s&#x2032;. A public keys randomizing unit generates first randomized public keys information obtained by randomizing public keys using the random number sand second randomized public keys information obtained by randomizing the public keys using the random number s. A proxy calculation unit calculates a first commission result by using a secret key and calculates a second commission result by using the secret key. A verification unit calculates a first verification value by using the random number s, calculates a second verification value by using the random number s, and verifies whether or not the first verification value and the second verification value coincide with each other. A common key calculation unit calculates a common key by using the random numbers s&#x2032;and s&#x2032;if the first verification value and the second verification value coincide with each other.

Key exchange method, key exchange system, key device, terminal device, and program

Disclosed is an optical semiconductor device having an optical semiconductor mounting element including a recess. On an inner side face of the recess is a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100&#xb0; C. to 200&#xb0; C., molding pressure of not more than 20 MPa, and molding time of 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%.

Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection

Growing community of inventors

Hitachi, Japan

Akira Nagai