Tdk Corporation

Toppan Printing Co., Ltd.

Toppan Inc.

Akira Motohashi

Yoshihiro Suzuki

Kazutoshi Tsuyutani

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

Sensor package substrate, sensor module including the same, and electronic component embedded substrate

A thermal transfer image receiving sheet includes: a substrate made of paper; a polyolefin resin layer formed on a first surface of the substrate; an adhesive layer formed on a second surface of the substrate facing away from the first surface; a porous layer formed on the adhesive layer; a foundation layer formed on the porous layer; and an image receiving layer formed on the foundation layer. A surface of the substrate, as defined in JIS B 0601:2001, has a maximum valley (undulation) depth Wv of 2.00 μm or less and a root mean square slope for the waviness WΔq of 0.013 or less. The porous layer has a thickness of 25 μm or more, and a thickness of the polyolefin resin layer is 0.2 to 3.0 times the thickness of the porous layer.

Thermal transfer image receiving sheet

A thermal transfer ribbon comprising a dye layer and a transferable protective layer repeatedly formed on one surface of a substrate, the transferable protective layer having a first layer formed on the substrate, and a second layer formed on the first layer. The first layer comprises an acrylic resin (X) containing methyl methacrylate, an acrylic resin (Y) containing a styrene resin, and a polyester resin (Z). X has a weight average molecular weight of 120000 or more, the mass ratio of X and Y is within the range of 1:9 to 9:1, and the mass of Z is 1% or more and 3% or less of the total mass of X and Y.

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Tokyo, Japan

Akira Motohashi