Fuji Electric Co., Ltd.

Fuji Electric Systems Co. Ltd.

Honda Motor Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Sumitomo Metal Ceramics Inc.

Akira Morozumi

Hiromichi Gohara

Takeshi Ichimura

Katsumi Yamada

Shin Soyano

Yoshikazu Takahashi

Kenji Suzuki

Tadashi Miyasaka

Yoshitaka Nishimura

Yoshinari Ikeda

Eiji Mochizuki

Masaharu Nishiura

Shigemasa Saito

Takatoshi Kobayashi

Susumu Toba

Kazuo Furihata

Masaki Ono

Takafumi Yamada

Takaki Nakagawa

Daisuke Takeuchi

Keiichi Higuchi

Yasuhiro Maeda

Tomio Shimizu

Souichi Okita

Toshio Nozaki

Seigo Oiwa

Kazunaga Ohnishi

Shizuyasu Yosida

Katumi Yamada

Hiroshi Miyama

Kazuya Matuura

Kazuhiko Teramura

A semiconductor device includes an insulated substrate, a semiconductor element mounted on a first main surface side of the insulated substrate, and a case housing that houses the insulated substrate and the semiconductor element so that a second main surface side of the insulated substrate is exposed. The outer circumferential portion of the insulated substrate is bonded to the case housing. The case housing is provided with a screw hole at a position facing the first main surface side of the insulated substrate. The semiconductor device further includes a screw that is screwed into a screw hole in the case housing and has a tip portion that contacts the first main surface side of the insulated substrate.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.

Semiconductor module with reinforcing board

A semiconductor module is provided, including: a cooling-target device; a first cooling unit on which the cooling-target device is placed and that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and a second cooling unit to which the first cooling unit is fixed and that has a flow channel coupled with the flow channel of the first cooling unit. Also, a semiconductor module manufacturing method is provided, including: placing a cooling-target device on a first cooling unit that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and fixing the first cooling unit to a second cooling unit that has a flow channel coupled with the flow channel of the first cooling unit.

Semiconductor module and manufacturing method of semiconductor module

A coolerof a semiconductor device includes an inlet portionand an outlet portionfor a cooling liquid, an inlet path, an outlet path, and a cooling flow path. The inlet pathand the outlet pathhave asymmetrical planar shapes. A connection portionbetween the inlet pathand the inlet portionis opposed to the cooling flow pathof a part immediately below plural circuit substratesarranged on the cooler. A connection portionbetween the outlet pathand the outlet portionis opposed to the cooling flow pathof a part immediately below plural circuit substratesarranged on the cooler

Semiconductor device having a cooler

A semiconductor module cooler for supplying a refrigerant from exterior into a water jacket and cooling a semiconductor device disposed on an outer surface of the cooler, includes a heat sink thermally connected to the semiconductor device; a first flow path extending from a refrigerant inlet and arranged with a guide portion having an inclined surface for guiding the refrigerant toward one side surface of the heat sink; a second flow path extending toward a refrigerant outlet and formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjustment plate disposed in the second flow path and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow path formed at a position communicating the first flow path and the second flow path. The heat sink is disposed in the third flow path.

Semiconductor module cooler and semiconductor module

A method for producing a semiconductor device includes solder-connecting a semiconductor chip, onto an insulating substrate including a ceramic board and having conductor layers on two surfaces thereof, with a lead-free solder; warping a radiating base such that a surface of the radiating base on a side opposite to the insulating substrate is convex; and solder-connecting the insulating substrate onto the warped radiating base with the lead-free solder so as to provide a substantially flat solder-connected radiating base.

Method for producing semiconductor device

Provided is a semiconductor device comprising a cooler in which, by improving the shape of the connecting portions of an inlet/outlet of a coolant or the like, the pressure loss in the connecting portion or the like can be reduced. A coolerof a semiconductor deviceincludes: an inletand an outletprovided on side wallsof a caseopposing to each other at diagonal positions; an introduction pathwhich is connected to the inletand formed in the case; a discharge pathwhich is connected to the outletand formed in the case; and a cooling flow channelbetween the introduction pathand the discharge path. The height of the opening of the inletis larger than the height of the introduction path, and a connecting portionbetween the inletand the introduction pathincludes an inclined surfacewhich is inclined from the bottom surface of the connecting portiontoward the longitudinal direction of the introduction path

Semiconductor device

A cooling device for a semiconductor module supplying a coolant from outside into a water jacket and cooling a semiconductor element, includes a heat sink thermally connected to the semiconductor element; a first flow channel extending from a coolant introducing port and including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed parallel to the first flow channel and extending toward a coolant discharge port; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed to communicate the first flow channel and the second flow channel. The heat sink is disposed in the third flow channel.

Cooling device for semiconductor module, and semiconductor module

A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel.

The characteristics of a heat radiation member used in a semiconductor module are improved. A heat radiation member (A) including an aluminum type member () which contains aluminum and a copper type member () which contains copper, which is embedded in the aluminum type member (), and sides of which are enclosed by the aluminum type member () is formed. A semiconductor element is thermally bonded to the heat radiation member (A) to fabricate a semiconductor module. The heat radiation member (A) includes the aluminum type member () and the copper type member (). As a result, it is possible to realize light weight while ensuring certain heat radiation. In addition, the copper type member () is enclosed by the aluminum type member (). Accordingly, the strength of the heat radiation member (A) can be increased.

Semiconductor module and heat radiation member

A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths () which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (). Fins () are arranged in each cooling flow path (). Semiconductor elements () and () are arranged over the cooling unit () so that the semiconductor elements () and () are thermally connected to the fins (). By doing so, a semiconductor module () is formed. Heat generated by the semiconductor elements () and () is conducted to the fins () arranged in each cooling flow path () and is removed by a refrigerant which flows along each cooling flow path ().

Semiconductor module and cooling unit

A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.

Semiconductor module and cooler

A method for manufacturing a semiconductor device has a step of forming a first substrate; a step of facing a first main electrode to the first metal foil, and electrically connecting the first main electrode and the first metal foil; a step of facing a second main electrode to the second metal foil, and electrically connecting the second main electrode and the second metal foil; a step of forming a second substrate; and steps of facing a surface side of the second substrate to a surface side of the first substrate; electrically connecting the third metal foil and a third main electrode provided on a main surface of the first semiconductor element; and electrically connecting the fourth metal foil and a fourth main electrode provided on a main surface of the second semiconductor element.

Method for manufacturing a semiconductor device

The object of the present invention is to efficiently dissipate heat from the upper and lower main surfaces of a semiconductor device carrying a semiconductor element. A semiconductor device () is provided with an insulating substrate (A), an insulating substrate (B) provided so as to face the insulating substrate (A), and a semiconductor element () disposed between the insulating substrate (A) and the insulating substrate (B) and having a collector electrode and an emitter electrode provided on the side opposite to that of the collector electrode. The collector electrode is electrically connected to a metal foil () provided on the insulating substrate (A), and the emitter electrode is electrically connected to the metal foil () provided on the insulating substrate (B). As a result, heat generated by the semiconductor element () is efficiently dissipated from the upper and lower main surfaces of the semiconductor device ().

In producing a semiconductor device, a solder alloy is prepared to contain antimony in a range of from 3 to 5 wt %, a trace amount of germanium, and a balance of tin. An insulative substrate having conductor patterns on both surfaces thereof is prepared, and a heat sink plate is mounted on a back surface of the insulative substrate by a soldering process using the solder alloy at a temperature ranging from 310 C.&#xb0; to 320 C.&#xb0; in a hydrogen reducing furnace. A semiconductor chip is mounted on a front surface of the insulative substrate.

Growing community of inventors

Okaya, Japan

Akira Morozumi