Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Akira Mori

Yasuharu Ueno

Shinji Kanayama

Akira Yamada

Shozo Minamitani

Makoto Morikawa

Takaharu Mae

Hiroyuki Naito

Nobuhisa Watanabe

Shinya Marumo

Makoto Akita

A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

Component mounting method, component mounting apparatus, and ultrasonic bonding head

A component mounting apparatus includes a component feeder () that feeds a component () with its bump electrodes facing down, a mounting head () that mounts the component onto a substrate (), a supporting base () that secures the substrate, and a positioning device () that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (), an ultrasonic vibration propagation member () that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face () holding the component as vibration parallel thereto, a pressure loader () that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater () that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes () on its face.

Electronic component mounting method and apparatus and ultrasonic bonding head

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Toyonaka, Japan

Akira Mori