Tokyo Electron Limited

Casio Computer Co., Ltd.

Nec Corporation

Mitsubishi Electric Corporation

Other

Fujitsu Corporation

Mobilous Inc.

Tokyo Elecetron Limited

Nippon Kayaku Kabushiki Kaisha

Akira Miyata

Suguru Enokida

Shinichi Hayashi

Nobuaki Matsuoka

Katsumi Kikuchi

Takanori Nishi

Suguru Watanabe

Tomohiro Kaneko

Tsunenaga Nakashima

Kenji Iriguchi

Yuichi Douki

Yoshitaka Hara

Masanori Tateyama

Hiroshi Tomita

Naruaki Iida

Yoshio Kimura

Takashi Iwasaki

Tomohiro Yamaji

Yuichi Yamamoto

Nobuyuki Takahashi

Yuji Suzuki

Kousuke Yoshihara

Tsuyoshi Yamamoto

Tomonori Sato

Yoshihito Hashimoto

Issei Ueda

Kunie Ogata

Yasushi Hayashida

Susumu Matsubara

Masaru Onozawa

Kazuto Yamamoto

Atsushi Shibutani

Michiaki Matsushita

Takashi Onoda

Mariko Umeda

Hideyuki Satou

Kenji Nanba

Ayami Yamaguchi

Masahiro Nakaharada

Makio Higashi

Yoji Sakata

Takao Nakai

Makoto Hayakawa

Yuka Mitani

Yuuichi Yamamoto

Shigeki Wada

Tatsuhei Yoshida

Kenichirou Matsuyama

Toshihiro Azuma

Masataka Matsunaga

Kouji Okamura

Shinsuke Shimizu

Kouji Fujimura

Shinichi Moritani

Osamu Moriyama

Hidekazu Kiyama

Mitsuyuki Akasawa

Kohichi Ueda

Syuzo Fujimaru

Ken Terao

Shigemi Kamimoto

Tomoya Kajikawa

Kensei Yamamoto

Yasuhiro Soshino

Yutaro Ichimura

Rakesh Sharrma

Sujoy Bhattacharjee

Tomonori Shin

Norio Senba

Shingo Okano

Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip () is flip-chip mounted on an interposer () by a bump (). A coplanar line () coupling adjacent quantum bits is formed on the quantum chip (). A gap () is provided, in the interposer (), at a location facing a center conductor () of the coplanar line (). A second ground electrode () is formed around gap (). The interposer () has a connection electrode () connecting the second ground electrode () around the gap (). A bump (A) formed in the vicinity of the connection electrode () is connected to the first ground electrode () and the second ground electrode ().

Quantum device and quantum computer

Provided are an oscillator and a quantum computer capable of suppressing an occupied area of a circuit. An oscillator () includes a resonator () including a plurality of loop circuits in which a first superconducting line (), a first Josephson junction (), a second superconducting line (), and a second Josephson junction () are annularly connected, and a magnetic field application circuit () including an electrode that goes around in a predetermined shape and configured to apply a magnetic field to the loop circuit, in which the electrode is arranged so as to face at least two of the loop circuits.

Oscillator and quantum computer

A quantum device according to an example embodiment includes: a quantum chip with a first surface and a second surface located on a side opposite to the first surface, in the quantum chip, at least a part of a qubit circuit being provided on the second surface; a first interposer with a third surface and a fourth surface located on a side opposite to the third surface, the first interposer being connected to the quantum chip in such a manner that the second surface of the quantum chip is opposed to the third surface of the first interposer; and a second interposer with a fifth surface and a sixth surface located on a side opposite to the fifth surface, the second interposer being connected to the first interposer in such a manner that the fourth surface of the first interpose is opposed to the fifth surface of the second interposer.

Quantum device

A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip, an interposeron which the quantum chipis mounted, and a socketdisposed so as to be opposed to the interposer, the socketcomprising a movable pinand a housingsupporting the movable pin, in which at least one end of the movable pin, which includes the one end and the other end opposite to the one end, is movable relative to the housing, the one end being in electrical contact with a terminal of the interposer, and the other end is in an electrical contact with a terminal of a boardon which a connectoris formed, the connectorbeing configured to serve as an external input/output.

A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip, and an interposeron which the quantum chipis mounted, in which the interposerincludes a conductive wiring line CLelectrically connected to the quantum chip, and a metal filmdisposed in a part of the interposerthat is in contact with a sample stagehaving a cooling function, and a mounting surfaceof the interposeron which the quantum chipis mounted or an opposite surfaceopposite to the mounting surfaceincludes a first area ARand a second area ARdifferent from the first area ARas viewed in a direction perpendicular to the mounting surfaceor the opposite surface

Quantum device having quantum chip on interposer in contact with sample stage

A quantum device () includes: an interposer (); a quantum chip (); a first connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (); and a second connection part () that is provided on a main surface of the interposer () where the first connection part () is arranged and is connected to a cooling plate ().

Quantum device and method of manufacturing the same

A quantum device according to an example embodiment includes a quantum chip, and an interposeron which the quantum chipis mounted, in which the interposerincludes a conductive wiring line CLelectrically connected to the quantum chip, a mounting surfaceof the interposeron which the quantum chipis mounted or an opposite surfaceopposite to the mounting surfaceincludes a first area ARand a second area ARdifferent from the first area ARas viewed in a direction perpendicular to the mounting surfaceor the opposite surface, the conductive wiring line CLis disposed in the first area ARon the mounting surfaceor the opposite surface, and a movable memberis in contact with the second area ARof the interposer

A quantum device () includes an interposer (), a quantum chip () mounted on the interposer (), and a shield part () provided so as to surround a quantum circuit region of the interposer () and the quantum chip (). Accordingly, the quantum device () is able to prevent interference in the quantum circuit region due to exogenous noise.

Quantum device including shield part and method of manufacturing the same

A quantum device () includes: an interposer (); a quantum chip (); and a connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (), in which the connection part () includes: a plurality of pillars () arranged on a main surface of the interposer (); and a metal film () provided on a surface of the plurality of pillars () in such a way that it contacts the wiring layer of the quantum chip () and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars () becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars ().

An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

Substrate treatment system, substrate transfer method and computer storage medium

Provided are a mobile terminal device and a safety verification system by which information for verifying safety can be collected and presented, while prompting evacuation. The device is provided with: a current location acquisition unit for acquiring the current location when disaster occurrence information has been received; a route display controller for displaying a route leading from the acquired current location to a preregistered evacuation site; a start display controller for displaying a start input screen via which an input indicating that evacuation has started can be entered; and an evacuation start information transmission unit which, in the event that evacuation start information indicating that evacuation has started has been input from the start input screen through an operation by the user, transmits the evacuation start information to a preregistered destination.

Mobile terminal device, call-to-action system, call-to-action method, call-to-action program, and safety verification system

A machining simulation device includes a local-region setting unit that sets a local region for a workpiece, an offset-deformation processing unit that offsets and deforms a shape of a part of a whole three-dimensional shape model of the workpiece, for which the local region is set, and generates a local three-dimensional shape model of the workpiece, a local tool-movement-data output unit that outputs local tool movement data from whole tool movement data based on a tool model and movement path data of a tool, a local cutting-deformation processing unit that cuts and deforms the local three-dimensional shape model of a workpiece based on the local tool movement data, and a display superimposing unit that superimposes the cut and deformed local three-dimensional shape model of the workpiece on the whole three-dimensional shape model of the workpiece, and displays the superimposed result.

Machining simulation device and method

A collision determination device includes a target cell designation unit that designates a target cell for a voxel model which represents the shape of a first object. A determination test point generation unit generates determination test points for the target cell. A spatial curve creation unit creates a spatial curve as the trajectory curve of a determination test point. A curve intersecting determination unit determines whether or not each boundary element of a boundary representation model representing the shape of a second object is intersecting the spatial curve. A distance computation unit computes the closest distance from the spatial curve to the boundary surface of the boundary representation model. A collision determination unit determines, based on the determination result and the computation result, whether there is a possibility of collision between both objects.

Collision determination device and collision determination program

To obtain an automatic programming apparatus, capable of generating a tool path for the chamfering process with a simple operation and capable of shortening the operation period and improving machining efficiency, the automatic programming apparatus includes a chamfering tool path generating unit and machining condition data. The chamfering tool path generating unit includes: a chamfered plane defining unit that generates shape data defining a chamfered plane obtained after the chamfering process is performed with respect to a shape of the chamfering target part; a reference point sequence generating unit that generates a reference point sequence used as a reference for generating the tool path data used for performing the chamfering process; and a tool reference position generating unit that, generates a reference position of a machining tool used when the machining tool passes while performing the chamfering process.

Automatic programming apparatus and automatic programming method

Growing community of inventors

Koshi, Japan

Akira Miyata