Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Akira Mima

Yukio Hattori

Daisuke Matsumoto

Hiroshi Kamizuma

Tetsuya Kawashima

Yuuichi Mabuchi

Ryouhei Miyagawa

Tomonori Ichikawa

Kinya Nakatsu

Toshiya Satoh

Takeshi Tokuyama

Shinji Shirakawa

Takahiro Araki

Yuichi Mabuchi

Hiroshi Kamiduma

There has been a problem that when a value of a current flowing through a thermistor increases, a voltage drop generated in the thermistor increases, and variations occur in a clamp voltage. A semiconductor device includes: a switching element that is on-off controlled; and a surge voltage protection circuit connected between a positive electrode side terminal of the switching element and a control terminal of the switching element. The surge voltage protection circuit includes a first Zener diode, a second Zener diode connected in series with the first Zener diode, and a temperature characteristic compensating element having a temperature coefficient different in polarity from the first Zener diode and the second Zener diode and connected in parallel with the second Zener diode.

Semiconductor device, power module, inverter device, and electric vehicle

To improve accessibility with respect to a power conversion unit in a power converter. The power converter includes a circuit connection part including a positive electrode conductor, a negative electrode conductor and an AC conductor, a power semiconductor module positioned in a particular direction with respect to the circuit connection part and connected to the positive electrode conductor, the negative electrode conductor and the AC conductor and a capacitor positioned in the particular direction with respect to the circuit connection part and connected to the positive electrode conductor and the negative electrode conductor. The positive electrode conductor is connected to a positive electrode conductor of another power conversion unit through a unit connection part positioned in an opposite direction of the particular direction with respect to the circuit connection part. The negative electrode conductor is connected to a negative electrode conductor of another power conversion unit through the unit connection part.

Power conversion unit, power converter and method of manufacturing power converter

An imbalance of control signals between two power semiconductor elements is reduced. A first power semiconductor module and a second power semiconductor module are arranged in a predetermined direction along a surface of a control signal wiring circuit board, each of longitudinal directions of the first power semiconductor module and the second power semiconductor module along the surface of the control signal wiring circuit board is a predetermined direction, and, in a first control signal wiring, a distance between an external control signal terminal and a second control signal terminal is equal to a distance between the external control signal terminal and a first control signal terminal.

Power conversion unit, power converter, and power conversion method

An uninterruptible power-supply system is a power converter having a PN laminated bus bar and a plurality of power conversion units and supplying power from a commercial power supply via a converter and an inverter. The power conversion units each have positive side terminals connected to each other and negative side terminals connected to each other through the PN laminated bus bar. At least one power conversion unit constitutes a phase of the converter. At least another one power conversion unit constitutes a phase of the inverter and has the positive side terminal lying adjacent to and connected through the PN laminated bus bar to the positive side terminal of the corresponding power conversion unit constituting the phase of the converter and the negative side terminal lying adjacent to and connected to the negative side terminal of the corresponding power conversion unit constituting the phase of the converter.

Power conversion device and power conversion method for power conversion device

A module of conversion circuit includes a High side IGBT, a Low side IGBT connected in series to the High side IGBT, a first terminal connected to the High side IGBT, a second terminal connected to the Low side IGBT, a capacitor connected to the first terminal and the second terminal, and a third terminal connected to a connection point between the High side IGBT and the Low side IGBT. A fourth terminal is engaged with the first terminal. A fifth terminal is engaged with the second terminal. A sixth terminal is engaged with the third terminal. The first and second terminals have at portions thereof between front edges and rear edges high-resistance parts having higher resistance than other portions.

Power conversion apparatus including terminals having higher resistance portions

The present invention reduces the footprint of a power conversion device. A first power semiconductor module and a second power semiconductor module are connected to a positive conductor, a negative conductor, and an alternating-current conductor. An external alternating-current terminal, the first power semiconductor module, the second power semiconductor module, a capacitor, and an external direct-current terminal including an external positive terminal and an external negative terminal are arrayed on a straight line extending in the longitudinal direction of a circuit connection section. The external alternating-current terminal is disposed at one longitudinal end of the circuit connection section. The external direct-current terminal is disposed at the other longitudinal end of the circuit connection section.

Power conversion unit and power conversion device

A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Cooling structure of heating element and power conversion device

A power converter that can be made compact and lightweight is provided. The power converter includes a control circuit power supply, a power semiconductor module that includes power conversion elements, a control circuit board that operates with power from the control circuit power supply and controls the power conversion elements, and a capacitor connected to the power conversion elements. In the power converter, the control circuit power supply charges the capacitor through the control circuit board. With this configuration, hot swapping of the power converter from the converter system can be performed. A boosting circuit may boost voltage of the control circuit power supply to charge the capacitor.

Power converter

A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers, a plurality of semiconductor modules, heat dissipation unitsto, a bus barconnecting the condenserswith the plurality of the semiconductor modules, and a ventilation unit having cool wind blow. The power conversion module has features that the plurality of semiconductor modulesare arranged apart from the condensersand in a line in a longitudinal direction of the bus barand that the cool windblows in a direction from the condenserstoward the plurality of semiconductor modulesthat are mounted.

Power conversion device

A cooling structure is provided. The cooling structure includes cooling surfaces on two confronting side surfaces; a plurality of double-sided-cooling power module, the heat receiving block pinching the heating elements arranged in a vertical direction on the confronting side surfaces, first and second cooling devices, each including the heat radiating fins, disposed above the heating elements, extending in a horizontal direction, and a pressure contacting part configured to contact the heating elements and the receiving block with a pressure force. The heat radiation fins are blown from a side of the electric terminal.

Cooling structure for heating element and power converter

The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module. It comprises a first power semiconductor device, a second power semiconductor device, a first conductor unit which is opposed to the first power semi conductor device, a second conductor unit which is opposed to the first conductor unit across the first power semiconductor device, a third conductor unit which is opposed to the second power semiconductor device, a fourth conductor unit which is opposed to the third conductor unit across the second power semiconductor device, a first intermediate conductor unit which extends from the first conductor unit, a second intermediate conductor unit which extends from the fourth conductor unit and, a positive electrode side first terminal, and a positive electrode side second terminal which project from the first intermediate conductor unit, and a negative electrode side first terminal and a negative electrode side second terminal which project from the second intermediate conductor unit. The negative electrode side first terminal is arranged in a position adjacent to the positive electrode side first terminal. The negative electrode side second terminal is arranged in a position adjacent to the positive electrode side second terminal.

Growing community of inventors

Tokyo, Japan

Akira Mima