Hitachi, Ltd.

Kabushiki Kaisha Toshiba

Akira Matsuo

Hitoshi Yokono

Hitoshi Oka

Tokio Isogai

Isamu Tanaka

Osamu Miyazawa

Hiroshi Kikuchi

Kenji Nakamura

Haruo Suzuki

Nobuo Nakagawa

Toyofusa Yoshimura

An automatic sending-message processing device is applied to a computer network which is connected to a plurality of computer systems via communication media and capable of effecting message switching among the plurality of computer systems by use of an electronic mail system. The processing device includes a memory for storing a rule in which a processing condition for processing mail message data and a content of a process obtained when the processing condition is satisfied, which are described according to the language specification of the mail message. The processing device further includes a control information analyzer for analyzing control information of the mail message data, an interpreter for collating the analyzed control information with the processing condition to interpret a process to be executed, a processor for executing a process on the mail message data corresponding to the process interpreted by the interpreting means, and electronic mail sender for sending a mail message consisting of the processed mail message data as electronic mail to other computer system users.

System for automatically sending mail message by storing rule according

During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution. These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.

Process for regenerating chemical copper plating solution

The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH. A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures.

Method for automatically controlling composition of chemical copper

When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.2 OH, is used as a complexing agent for cupric ions and a nitrogen-containing cyclic compound is used as a complexing agent for cuprous ions in an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent and a stabilizer, or an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent, a stabilizer and a complexing agent for cuprous ions, the plating rate of the electroless copper plating solution, mechanical strength of plating film, and stability of the plating solution are improved.

Electroless copper plating solution

Growing community of inventors

Yokohama, Japan

Akira Matsuo