Shin-etsu Chemical Co., Ltd.

Shin-etsu Handotai Co., Ltd.

Akira Matsuda

Shigeki Shudo

Hironao Fujiki

Noboru Shimamoto

Yasushi Yamamoto

Noriyoshi Ogawa

Hiromasa Hashimoto

Kazuhiko Tomaru

Fumio Suzuki

Toshiaki Takata

Kohichi Tanaka

Yuji Fujita

Eiji Kuchiki

In a polypropylene resin/silicone rubber integrally molded article, a polypropylene resin having an aliphatic unsaturated bond is integrally joined to an addition type silicone rubber at high bond strength. It is prepared by injection molding a modified polypropylene resin into a preform, injection molding a silicone rubber composition over the preform, and curing the composition at a temperature below the softening point of the polypropylene resin. Stronger bond is established when the silicone rubber contains a tackifier in the form of a compound containing in a molecule at least one hydrogen atom directly attached to a silicon atom and an alkoxysilyl, glycidyl or acid anhydride group or a --(CH.sub.2).sub.n -- linkage.

Integrally molded article of silicone rubber and modified polypropylene

An adhesive silicone rubber composition of addition reaction curing type comprising (a) an organopolysiloxane containing an alkenyl group; (b) an organohydrogenpolysiloxane having at least one hydrogen atom directly attached to a silicon atom in a molecule; (c) an addition reaction catalyst; and (d) an adhesive agent selected from compounds of the following formulae (I), (II) and (III):

Adhesive silicone rubber compositions

In a polycarbonate resin/silicone rubber integrally molded article, a polycarbonate resin having an aliphatic unsaturated group, typically an isopropenyl group is integrally joined to an addition type silicone rubber containing a tackifier component at high bond strength. It is prepared by injection molding a modified polycarbonate resin into a preform, injection molding a silicone rubber composition over the preform, and curing the composition at a temperature below the softening point of the polycarbonate resin.

Polycarbonate resin/silicone rubber integrally molded article and method

A method of chucking semiconductor wafers, in which a silicone elastic layer with high flatness is formed on the surface of a hard substrate having fine through-holes for vacuum chucking. Next fine through-holes in the silicone elastic layer, are provided, each through-hole communicating with the fine through-holes of the hard substrate. Next a semi-conductor wafer is held on the hard substrate by vacuum chucking from the back side of the substrate, so as to hold the semiconductor wafer securely on the substrate only by surface adhesion of the silicone elastic layer during polishing of the wafer. This method does not require wax or similar adhesive for holding the semiconductor wafer on the hard surface during the polishing process, and can realize a high-precision and high-quality surface polishing process for the semiconductor wafers.

Method of chucking semiconductor wafers

An improvement is proposed in the assemblage of a cover-packing bult-up body for a magnetic hard-disc unit to be freed from the troubles caused by dusts or contamination of the gap space between the magnetic recording disc and the magnetic head as well as by the poor vibration-damping characteristics of the rubber packing between the covering member and the body of the casing. The improvement comprises, instead of using a pre-shaped rubber packing, the built-up body is assembled by using a curable liquid silicone rubber-based composition filled with fine hollow microspheres to form a packing on the surface of the covering member by the in situ curing of the composition applied thereto so that the rubbery packing layer has a spongy structure exhibiting good vibration-damping characteristics.

Integral packing/covering member for hard-disc unit

Growing community of inventors

Annaka, Japan

Akira Matsuda