The Furukawa Electric Co., Ltd.

Sony Corporation

Nippon Telegraph and Telephone Corporation

Nippondenso Co., Ltd.

Furukawa Circuit Foil Co., Ltd.

Mabuchi Motor Kabushiki Kaisha

Sony Olympus Medical Solutions Inc.

Tokyo University of Agriculture and Technology

Kyowa Electric Wire Co., Ltd.

Furkawa Circuit Foil Co., Ltd.

Akira Matsuda

Yuuji Suzuki

Nobuyuki Shibata

Satoshi Suzuki

Taichi Hirano

Ryotomo Shirakawa

Kazuaki Toba

Hitoshi Irino

Morimasa Tanimoto

Hideo Otsuka

Kiichi Akasaka

Sadao Matsumoto

Yuuki Kikuchi

Syoji Shiga

Hitoshi Tanaka

Hiroshi Matsuda

Shoji Shiga

Kei Tomatsu

Kaisuke Shiroyama

Hideo Suda

Akira Iino

Kensaku Shinozaki

Yoshiaki Ogiwara

Kazuhiro Hoshino

Takami Moteki

Masaki Yasuhara

Akane Tanaka

Kinya Sugie

Ryotomo Sirakawa

Takeo Nakamura

Hirohisa Iwai

A network system in which network relay devices such as switches or routers which reduce the load of VPN path information are connected to a Clos topology and a configuration method thereof are provided. A network system according to the present invention is a network system in which a plurality of network relay devices that are routers or switches are connected by a leaf/spine type Clos topology and which performs path control using BGP. Each of the plurality of network relay devices belongs to an entire AS made up of all of the plurality of network relay devices by BGP confederation, and the respective network relay devices belong to a sub AS. A leaf type network relay device is connected to a spine type network relay device via an eiBGP peer and is connected to the other leaf type network relay devices via as iBGP peer.

Network system and configuration method therefor

Monitoring for preventative maintenance using Simple Network Management Protocol (SNMP) polling suitable for a large scale network is realized. A controller of the present invention for use in a system that monitors a plurality of monitored apparatuses by SNMP polling includes a request duplication unit that duplicates an SNMP request from an operator terminal, and a request transmission unit that transmits the duplicated SNMP requests to the monitored apparatuses all at once. The controller includes a response calculation unit that calculates an operator response value from a response value of the monitored apparatus which is retained in an apparatus information database (DB) according to a monitoring policy retained in a monitoring policy DB.

Relay device and relay method

There is provided a connector including a signal pin that stretches in a first direction and transmits a signal, a substrate that has one surface on which the signal pin is formed, and an electric conductor layer that has ground potential, the electric conductor layer being formed on an opposite surface of the surface of the substrate on which the signal pin is formed.

Connector system capable of mitigating signal deterioration

There is provided a wire connection device including an outer frame that has a tubular shape, and a plurality of contacts that are provided in the outer frame, and that have a plurality of pairs of differential contacts to which a plurality of pairs of differential signals are respectively allocated, and a plurality of ground contacts each to which ground is allocated. When viewed from a direction along a central axis of the outer frame, the plurality of contacts are arranged side by side in two rows in a manner that the differential contacts of each pair can be adjacent to each other and in a manner that the number of the ground contacts adjacent to one of the differential contacts of each pair is equal to the number of the ground contacts adjacent to the other one of the differential contacts of the pair.

Wire connection device, camera head and endoscopic device

To be able to further reduce deterioration in signal quality, there is provided a connector including: a signal pin () that is connected to a wiring pattern () on a mounted substrate () and that transmits a signal to an inside and an outside of any apparatus, the mounted substrate () having an end disposed in the apparatus; and a shell () that is formed of an electric conductor and grounded to ground potential on the mounted substrate (), in a manner that the shell () covers the signal pin () in a region in which the signal pin () stretches toward the mounted substrate ().

Connector, data transmitting apparatus, data receiving apparatus, and data transmitting and receiving system

An oligonucleotide that inhibits the binding of a serine/arginine-rich protein 30c (SRp30c) to a pre-mRNA of a glucocorticoid receptor gene in vivo.

Oligonucleotide, glucocorticoid sensitivity enhancer, pharmaceutical composition, and expression vector

A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil

A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

Method for preparing a circuit board material having a conductive base and a resistance layer

An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 &#x3bc;m, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 &#x3bc;m by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board

A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Conductive substrate with resistance layer, resistance board, and resistance circuit board

An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.

Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier

To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating of Cu or a Cu alloy, and a top-coating of Sn or an Sn alloy, the undercoating, the intermediate coating and the top-coating being formed on a surface of an electrically conductive base in this order, and the thickness of the top-coating is 1.9 times or more the thickness of the intermediate coating.

Plated material, method of producing same, and electrical/electronic part using same

A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.

Lead material for electronic part, lead and semiconductor device using

A plating method for a nickel-titanium alloy member is provided which comprises the steps of: subjecting a nickel-titanium alloy member to an anodic electrolyzing treatment and a cathodic electrolyzing treatment in succession by using an electrolyte containing hydrochloric acid as an essential component thereof, in particular, an electrolyte having a chloride ion concentration of 0.1 mol/l or more and a pH value of 2 or less, or an electrolyte having a chloride ion concentration of 0.4 mol/l or more, or still preferably, an electrolyte having a chlorine ion concentration of 0.3 mol/l or more and a pH value of 2 or less; strike plating the treated nickel-titanium alloy member with a desired metal; and electroplating the struck nickel-titanium alloy member with a desired metal. The adhesion between the nickel-titanium alloy member and a plating layer is very good.

Plating method for a nickel-titanium alloy member

An electric contact material containing Li oxide of 0.01 to 2.0% by weight when represented in terms of the amount of Li, oxide of at least one rare earth element of 0.05 to 0.18% by weight when represented in terms of the amount of the rare earth element, and Ag or Ag alloy as the remaining portion; an electric contact material containing Li oxide of 0.01 to 2.0% by weight when represented in terms of the amount of Li, at least one rare earth element of 0.05 to 0.18% by weight when represented in terms of the amount of the rare earth element, at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi by an amount of 0.1 to 1.0% by weight (however, in the case of Zn and Mn, the amount is set less than 0.5% by weight), and/or at least one element selected from a group consisting of Fe, Ni and Co by an amount of 0.03 to 0.6% by weight, and Ag as the remaining portion; and an electric contact formed by using the above material. It is excellent in the arc resistance, wear resistance an lubricity in a small current region and is suitable as the material for a slide contact and rotary slide contact.

Growing community of inventors

Tokyo, Japan

Akira Matsuda