Sumitomo Electric Industries, Limited

Toyo Kohan Co., Ltd.

Akira Kaneko

Hironao Okayama

Hajime Ota

Takashi Yamaguchi

Kotaro Ohki

Kouji Nanbu

Takeshi Kato

Kazuhiko Hayashi

Kazuya Ohmatsu

Masaya Konishi

Teppei Kurokawa

Yoshihiko Isobe

Takashi Koshiro

Kazuya Ohmastu

A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate Thaving a thickness of not more than 0.2 mm and a metal foil Tmade of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 &#x3bc;m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150&#xb0; C. and not more than 1000&#xb0; C. and, thereafter, an epitaxial growth film Tmade of Ni or an Ni alloy having a thickness of not more than 10 &#x3bc;m is laminated to the metal foil.

Method for producing metal laminated substrate for oxide superconducting wire, and oxide superconducting wire using the substrate

Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

Substrate for superconducting compound and method for manufacturing the substrate

A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method therefor

Growing community of inventors

Kudamatsu, Japan

Akira Kaneko