Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Akira Kameda

Ryuji Hamada

Shinjiro Tsuji

Yoshihiro Mimura

Toshihiko Tsujikawa

Shingo Yamada

Nobuyuki Kakita

Atsushi Katayama

Masaki Kishimoto

In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.

Component mounter and mounting board manufacturing method

A tray supplier which performs supplying and collecting of trays includes a supply-side tray storage unit, a collection-side tray storage unit, a first tray placer and a second tray placer on which the trays are placed, and a first placer mover and a second placer mover which respectively move the tray placers between the supply-side tray storage unit and the collection-side tray storage unit, in which a first movement shaft of the first placer mover and a second movement shaft of the second placer mover are disposed parallel to each other, lifting and lowering units which lift or lower the first tray placer and the second tray placer are provided, and interference between the placer movers does not occur.

Tray supplier and tray supply method

A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.

Component bonding device

A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.

Component crimping apparatus

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

Component mounting method

Aims to provide an inspection apparatus and an inspection method for detecting an amount of misalignment of a component mounted on a panel through an ACF. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a panel's top surface through an AFC, and includes: a visible light illuminator () which illuminates with visible light a panel recognition mark formed on the panel's top surface; an infrared light illuminator which is provided on a side of the component's bottom surface not adhered to the panel and illuminates with infrared light a component recognition mark formed on the component's top surface; a visible light camera () which is provided on a bottom surface side of the panel which is opposite to a side of the panel on which the component is mounted, and which captures an image of the panel recognition mark illuminated with the visible light; an infrared camera () which is provided on a side of a bottom surface of the component not adhered to the panel, and which captures an image of the component recognition mark illuminated with the infrared light; and an amount-of-misalignment calculation unit which calculates an amount of misalignment from a predetermined positional relationship between the panel recognition mark and the component recognition mark based on the captured images of the panel recognition mark and the component recognition mark.

Inspection apparatus and inspection method

An inspection apparatus and method for precisely detect an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF, and includes: a visible light camera which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component; an obtaining unit which obtains, from the image captured by the camera, positions of feature points of the respective recognition marks; and a calculation unit which calculates an amount of misalignment of the feature point of the component recognition mark in the image captured by the camera from a predetermined position that is determined using the position of the feature point of the panel recognition mark as a reference.

A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flexible board, after holding the other end portion including the other end electrode, which is positionally adjusted based on the position recognition result of the mounting portion the press tool recognizing the position of the other end electrode, matching the positions of the mounting portion and the other end electrode by relative positional adjusting, and mounting the other end electrode on the mounting portion by temporarily pressing the other end electrode on the mounting portion.

Growing community of inventors

Osaka, Japan

Akira Kameda