Futaba Denshi Kogyo K.k.

Akira Kadowaki

Shigeo Itoh

Takeshi Tonegawa

Yoshio Makita

Tatsuo Yamaura

Teruo Watanabe

Mikio Yokoyama

Gentaro Tanaka

Yuuichi Kogure

Yoshihiko Hirata

Youich Kogure

Method for forming a vacuum hermetic vessel. Plural exhaust holes are formed in the first main substrate at a number of positions. A second main substrate is superposed over the first main substrate. The two substrates are hermetically sealed. The two substrates are cut at predetermined positions to form individual vessels. Lead-out electrodes are formed on both the first and second substrates and are not covered by another substrate. The vessels are evacuated and sealed using exhaust tubes.

Method of manufacturing vacuum hermetic vessels

A getter support capable of permitting a getter to be compactly arranged in a vacuum envelope while keeping a space for the getter minimized. The getter support includes holders for vertically interposedly holding a getter, first support legs formed integrally with the holders so as to downwardly extend therefrom, and second support legs formed integrally with the holders so as to upwardly extend therefrom. The getter support is fixedly arranged in a getter chamber while being pressed by elasticity of the second support legs. The second support legs are varied in deflection depending on contact thereof with a second substrate of an envelope. This permits a distance between an upper surface of the getter and the second substrate of the envelope to be constantly kept at a desired value.

Getter support

A vacuum airtight envelope capable of being manufactured in bulk and with increased yields. Cathode substrates and anode substrates are prepared by multisubstrate co-formation techniques. A cathode source plate is cut into a plurality of individual cathode substrates, which are mounted on an anode source plate by surface-mounting. Then, getter boxes are temporarily fixed on the anode source plate and then sealedly joined thereto together with cathode substrates. Then, the anode source plate is cut, to thereby provide individual envelopes, which are then evacuated to a vacuum.

Vacuum airtight envelope and method for manufacturing same

A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.

Method for sealedly forming envelope

An evacuation apparatus is capable of evacuating an envelope to a high vacuum without evacuating a whole room or chamber to a high vacuum. An evacuation pipe is connected at a distal end thereof to an evacuation head and a vacuum pump is actuated to evacuate an evacuation chamber to a high vacuum, to thereby evacuate an envelope to a high vacuum. Then, a motor is driven to rotate ball screws, to thereby upwardly move the envelope mounted on the evacuation head. The evacuation pipe is fused at an intermediate portion thereof by a gas burner, to thereby be sealed. Then, the evacuation pipe is cut to disconnect the envelope from the evacuation head.

Growing community of inventors

Mobara, Japan

Akira Kadowaki