Panasonic Intellectual Property Management Co., Ltd.

Nipro Corporation

Akira Ito

Eiichiro Saito

Hiroyuki Furuya

Takashi Matsumoto

Susumu Uragami

Yuta Moriura

Hironobu Ukitsu

Takeshi Nizuka

Morio Nakatani

Yoshihisa Murai

Naohito Fukuya

Kenji Kitamura

Shin-ich Kawamura

Kengo Yamanouti

Dai Sutou

Yozo Matsukawa

A load sensor includes: a base member being insulative and having elasticity; an electrode having elasticity and formed on an upper face of the base member; and a wire member being electrically conductive and disposed so as to be superposed on an upper face of the electrode, a surface of the wire member being covered by a dielectric body. A ratio of a thickness of the electrode to a thickness of the base member is not less than 0.02 and not greater than 0.3.

Load sensor

A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from &#xbc; to &#xbe;, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within &#xb1;20&#xb0; C. of a glass transition temperature of the inner insulating layer.

Printed wiring board, printed circuit board, prepreg

A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 &#x3bc;m to 630 &#x3bc;m, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer. The thick conductor built-in type printed wiring board does not include a void having a diameter of more than or equal to 10 &#x3bc;m inside the thick conductor built-in type printed wiring board.

Thick conductor built-in type printed wiring board and method for producing same

The cationically photopolymerizable composition according to the present disclosure includes: (A) a polyfunctional epoxy compound having two or more epoxy groups per molecule; (B) a monofunctional epoxy compound having one epoxy group per molecule; (C) a photocation generator; and (D) an oxetane compound. At least one of the component (A) and the component (B) contains an epoxy compound ((A1) or (B1)) having a polyether backbone per molecule. A mass ratio of the component (A) to the component (B) falls within a range of 90:10 to 30:70.

Cationically photopolymerizable composition, bonding method, electronic device, method for manufacturing electronic device, display device and method for manufacturing display device

A syringe coated with a lubricant containing a silicone oil and a fine silica powder on the inner surface of the barrel of the syringe can be used for injection of a surface-active drug solution without oil droplet formation on the inner surface while preventing an increase of the gasket sliding friction.

Syringe

Growing community of inventors

Osaka, Japan

Akira Ito