Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Akira Iso

Shuangching Chen

Syougo Ogawa

Takashi Hyakutake

Syuuji Miyashita

Hiroyuki Uwazumi

Youichi Tei

Naoki Takizawa

Hajime Kurihara

Takahiro Shimizu

Kazuhito Higuchi

Miyabi Nakamura

Makoto Isozaki

Kengo Kainuma

Takahiro Mitsumoto

A semiconductor device includes a base plate to which a stacked substrate is bonded, the stacked substrate being mounted on a semiconductor chip. The semiconductor device further includes a heat sink mounted to the base plate, via thermal paste and a metal ring. A center hole of the metal ring is provided to face the semiconductor chip and the thermal paste fills the center hole. Further, the metal ring is formed using a material having about a same hardness as the heat sink, or a material having a lower hardness than the hardness of the heat sink.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device is provided comprising a semiconductor element, a case portion housing the semiconductor element and having an opening end on at least some of wall portion, a lid portion covering the opening end of the case portion, and a sealing material sealing the semiconductor element inside the case portion, where a projection portion or a dent portion is provided on a surface of the wall portion close to the sealing material between the opening end and the sealing material. The Purpose is to prevent an oil leakage from a semiconductor device. Also, instead of the projection portion or the dent portion, a semiconductor device is provided with a liquid receiving portion that receives a liquid dripping from the opening end on a surface facing away from the sealing material.

Semiconductor device and electrical device

Provided is a soldering method through nickel plating layer to reduce void occurrence rate and a method of manufacturing semiconductor device by using the soldering method. By heating a copper base plate having a nickel plating layer at a temperature range of 300&#xb0; C. to 400&#xb0; C. in an inert gas atmosphere beforehand, void occurrence rate can be reduced in soldering the copper base plate to an insulating circuit board.

Soldering method and method of manufacturing semiconductor device

Semiconductor device

An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method even to a thickness of 1 &#x3bc;m or more. Before forming a plating film by a step of electroless plating S, a surface treatment process is conducted on a surface of the base plate composed of a glass material. The surface treatment process comprises at least a step of glass activation treatment Sto increase quantity of silanol groups on the surface of the base plate at least by a factor of two using an aqueous solution of diluted acid, a step of silane coupling agent treatment S, a step of palladium catalyst treatment S, and a step of palladium bonding treatment S

Method of manufacturing a disk substrate for a magnetic recording medium

A disk substrate for a perpendicular magnetic recording medium is, disclosed. The substrate exhibits sufficient productivity, serves the function of a soft magnetic backing layer of the perpendicular magnetic recording medium, and scarcely generates noise. A perpendicular magnetic recording medium using such a substrate also is disclosed. The disk substrate comprises at least a soft magnetic underlayer formed on a nonmagnetic base plate by means of an electroless plating method. The thermal expansion coefficient of the soft magnetic underlayer is larger than a thermal expansion coefficient of the nonmagnetic disk-shaped base plate. A saturation magnetostriction constant &#x3bb;s satisfies a relation &#x3bb;s&#x2267;&#x2212;1&#xd7;10.

Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate

A method of plating on a glass substrate allowing an electroless plating film with good adhesiveness to be formed by chemically bonding a silane coupling agent in a state of simple adhesion or hydrogen bond to the surface of the glass substrate through dehydration condensation reaction, and a method of manufacturing a magnetic recording medium using the plating method. In the plating method, electroless plating is performed on a glass substrate after sequentially conducting at least the adhesion layer formation that forms an adhesion layer using a silane coupling agent solution, catalyst layer formation, a catalyst activation, and a drying that chemically bonds the silane coupling agent in the adhesion layer to the surface of the glass substrate.

Method of electroless plating on a glass substrate and method of manufacturing a magnetic recording medium using the method of electroless plating

A magnetic recording medium using a plastic substrate as a non-magnetic substrate includes an adhesive layer that prevents film expansion even under severe conditions. The adhesive layer has a chemical affinity to the plastic substrate and is formed on the surface of the plastic substrate, and an underlayer and subsequent layers are formed over the adhesive layer. A polymerized carbon film is used as the adhesive layer.

Magnetic recording medium, method of manufacturing the same and magnetic recording apparatus

A method of manufacturing a magnetic recording medium facilitates preventing a film inflation from occurring in an environmental condition range between &#x2212;40&#xb0; C. and 80&#xb0; C. and an 80% relative humidity. The magnetic recording medium includes a plastic substrate and an undercoating layer on the plastic substrate. The undercoating layer is provided with a columnar structure, which prevents water (moisture) between the plastic substrate and the undercoating layer from aggregating and, therefore, the film inflation from occurring.

Method of manufacturing a magnetic recording medium

A magnetic recording medium according to the invention includes a nonmagnetic substrate made of a polymer resin, the nonmagnetic substrate having been treated to improve an adhesion characteristic thereof; an adhesive layer on the nonmagnetic substrate, a nonmagnetic undercoating layer on the an adhesive layer; a magnetic layer above the nonmagnetic undercoating layer; a protection layer above the magnetic layer; and a liquid lubricant layer on the protection layer. A method of manufacturing the magnetic recording medium described above includes the steps of: treating a nonmagnetic substrate to improve an adhesion characteristic thereof; forming an adhesive layer on the nonmagnetic substrate, the adhesion thereof having been improved; forming a nonmagnetic undercoating layer on the adhesive layer; forming a magnetic layer above the nonmagnetic undercoating layer; forming a protection layer above the magnetic layer; and forming a liquid lubricant layer on the protection layer. A magnetic storage device according to the invention mounts thereon the magnetic recording medium described above.

Magnetic recording medium, a method of manufacturing the same, and a magnetic storage device using the magnetic recording medium

A magnetic recording medium that does not develop film swelling when exposed to severe conditions has a nonmagnetic substrate having a trench formed in the area within 2 mm from and concentrically with the outer circumference or the inner circumference of the nonmagnetic substrate, or formed outside the data area concentrically with the outer circumference or the inner circumference of the nonmagnetic substrate.

Growing community of inventors

Nagano, Japan

Akira Iso