Mitsubishi Denki Kabushiki Kaisha

Akira Ishizu

Hayato Takasago

Yasuo Inoue

Tadashi Nishimura

Kenichi Niki

Tohru Kokogawa

Mitsuyuki Takada

Eishi Gofuku

Toshio Tobita

Hirofumi Ohuchida

A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.

Process for preparing a combined wiring substrate

A thin film semiconductor device is formed by preparing a substrate, forming a pattern of metal thin film on the substrate, forming an insulating layer on the metal thin film, and forming a pattern of a semiconductor thin film active layer over the pattern of the metal thin film by laser CVD.

Thin film semiconductor device with oxide film on insulating layer

In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.

Testing device for electrical circuit boards

A thin film semiconductor device is formed by preparing a substrate, forming a pattern of metal thin film on the substrate, forming an insulating layer on the metal thin film, and forming a pattern of a semiconductor thin film active layer, which is self-aligned to the pattern of the metal thin film, by laser CVD.

Growing community of inventors

Amagasaki, Japan

Akira Ishizu