Dexerials Corporation

Sony Corporation & Information Device Corporation

Akira Ishigami

Hidetsugu Namiki

Shiyuki Kanisawa

Masaharu Aoki

Hideaki Umakoshi

Yoshihisa Shinya

Taichi Koyama

An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

Adhesive agent and connection structure

This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

Adhesive and light-emitting device

An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.

Anisotropic conductive adhesive

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.

Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive

A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.

Light-reflective anisotropic conductive adhesive agent, and light emitting device

A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.

Light-reflective anisotropic conductive adhesive and light-emitting device

A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/&#xb0; C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.

Buffer film for multi-chip packaging

A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.

Growing community of inventors

Tochigi, Japan

Akira Ishigami