Panasonic Intellectual Property Management Co., Ltd.

Akira Irifune

Yuki Kitai

Tatsuya Arisawa

Yuki Inoue

Yuki Tokuda

Mitsuyoshi Nishino

Shun Yamaguchi

Fuminori Satou

Takashi Sagara

Takayuki Nakashima

Kazuei Endou

Shohei Hanazaki

A metal-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by Formula (1) in a molecule and a metal foil that is laminated on the insulating layer and is a metal foil in which a nickel element amount on a surface on a side in contact with the insulating layer and a nickel element amount on the surface when the surface is sputtered for 1 minute at 3 nm/min in terms of SiOare each 4.5 at % or less with respect to the total element amount on each surface. In Formula (1), Z represents an arylene group, R-Reach independently represent a hydrogen atom or an alkyl group, and R-Reach independently represent a hydrogen atom or an alkyl group having 1-6 carbon atoms.

Metal-clad laminate, wiring board, resin-including metal foil, and resin composition

A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25&#xb0; C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 &#x3bc;m or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt. 

Metal-clad laminate and metal foil with resin

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Fukushima, Japan

Akira Irifune