E.i. Dupont De Nemours and Company

Kabushiki Kaisha Toshiba

Fujitsu Corporation

Tokyo Metropolitan Institute of Medical Science

Akira Inaba

Naoto Nakajima

Shuichi Tsunoda

Yasuo Yamamoto

Ji-Yeon Lee

Takayuki Oba

Yasuhiro Okada

Takashi Kitagaki

Takeshi Kondo

Shinji Kakei

Jongho Lee

Satoshi Orimo

Satomi Yamashita

The present invention has an objective of evaluating a motor function of a subject with a neurodegenerative disease with high accuracy using a motor function analysis system that utilizes a wrist joint movement of the subject. The motor function analysis system includes: a display unit for displaying image information including a moving target image and a cursor image for tracking the target image; a moving unit used by the subject to move the cursor image; and an analyzer for detecting the tracking status of the target image tracked by the cursor image and analyzing the frequency of the movement components contained in the tracking status.

Motor function analysis system and operational method of system

An electric component comprising a terminal electrode and a hot-melt polymer layer formed on the terminal electrode, wherein the hot-melt polymer layer comprises (i) 100 parts by weight of a metal powder and (ii) 1 to 30 parts by weight of a polymer, wherein melt mass-flow rate (MFR) of the polymer is 0.5 to 20 g/10 min. at 120 to 200&#xb0; C. and 0.3 to 8 kgf.

Electronic component

A method of manufacturing a non-fired type electrode comprising the steps of: (a) applying a conductive paste on a substrate, the conductive paste comprising; (i) 100 parts by weight of a conductive powder; (ii) an organic boron compound comprising an amine borate, a boronic acid, a boronic acid ester, a trimer of the boronic acid or a mixture thereof, wherein the boron element of the organic boron compound is 0.03 to 1.4 parts by weight; and (iii) 20 to 150 parts by weight of an organic vehicle; and (b) heating the applied conductive paste at 100 to 300&#xb0; C.

Method of manufacturing non-firing type electrode

A solar cell comprising a p-doped silicon wafer, wherein the p-doped silicon wafer comprises a light-receiving side and a back side; and an aluminum electrode formed on the back side of the silicon wafer; wherein the aluminum electrode comprises an aluminum base layer formed adjacently on the back side of the silicon wafer and an aluminum cover layer formed on the aluminum base layer, and wherein the aluminum cover layer comprises aluminum and boron oxide (BO).

Solar cell comprising a p-doped silicon wafer and an aluminum electrode

A method of manufacturing a non-firing type electrode comprising steps of: (A) applying a conductive paste on a substrate; (B) heating the applied conductive paste at 50 to 350&#xb0; C. to form an electrode; and (C) pressing the electrode at 10 to 1000 kN/mof plane surface pressure or at 5 to 300 kN/m of linear pressure.

A method of manufacturing a non-firing type electrode comprising steps of: (A) applying on a substrate a conductive paste comprising, (a) a conductive powder comprising, (i) a first conductive powder having Young's modulus of 60&#xd7;10Pa or higher; and (ii) a second conductive powder having Young's modulus of 5&#xd7;10to 50&#xd7;10Pa; and (b) an organic vehicle, (B) heating the applied conductive paste at 50 to 350&#xb0; C. to form an electrode; and (C) pressing the electrode at 10 to 1000 kN/mof plane surface pressure or at 5 to 300 kN/m of linear pressure.

Disclosed is an electrically conductive adhesive that includes an electrically conductive powder, a heat-curable silicone resin, and a solvent.

Electrically conductive adhesive

A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 &#x3bc;m, and the glass powder is a BiO&#x2014;SiO&#x2014;BOtype glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.

Silver-palladium alloy containing conductor paste for ceramic substrate and electric circuit

The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.

Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package

Conductor paste for ceramic substrate and electric circuit

The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition.

Electrically conductive composition for via-holes

Different signal patterns are inserted in different time slots within a vacant slot for signals passing through redundantly configured units. A selector, which selects one of the units as a working unit, is controlled to select the inserted signal patterns in sequence. A pattern monitoring circuit is provided on the output side of the selector, and identifies a faulty unit by detecting an abnormality in a signal pattern.

Growing community of inventors

Kawasaki, Japan

Akira Inaba