Hisaka Works, Ltd.

Sumitomo Mitsubishi Silicon Corporation

Kashiwara Machine Mfg. Co., Ltd.

Sumco Corporation

Akira Horiguchi

Hiroyuki Sumitomo

Kenzo Masutani

Ken'ichi Yamada

Ken Isobe

Hiroshi Matsumoto

Yoshiaki Uzu

Heigo Tanaka

Tomio Fukushima

Shoji Nakao

Kiyohide Murata

Hiroto Fukushima

Tomonori Miura

Tsuneo Takeda

Tsunco Takeda

To propose a method for realizing appropriate delivering of works to carriers in the conventional transfer process. Specifically, in a polishing method for polishing a work retained in a carrier, at least one carrier for retaining a work to be polished is placed between an upper plate and a lower plate; the work is fit in a hole of the carrier; the carrier and the work are inserted between the upper plate and the lower plate; and at least one of the upper plate and the lower plate is rotated while supplying a polishing agent to a space between the upper plate and the lower plate. In fitting the work in the hole of the carrier, an end portion of the work is held and the work is carried to a position above the lower plate; the work is positioned with respect to the hole of the carrier on the lower plate; and the work is released from the hold and guided by a guide to be slowly carried down toward the hole.

Polishing method and polishing apparatus

To provide a technique for rotating a plurality of carriersbetween an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works. The workis merged with the carrieroutside a polishing apparatus main body. The workis supplied onto a lower rotary surface plateof the polishing apparatus main bodywhile remaining merged with the carrier. The present invention enables the workon the lower rotary surface plateto be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of worksto have both surfaces thereof polished, on the lower rotary surface plate. The present invention enables the worksto be automatically ejected from the lower rotary surface plate. A brush housing sectionand a dresser housing sectionare provided near the polishing apparatus main body. Brushes and dressers are used to frequently efficiently process polishing clothes installed on opposite surfaces of the upper and lower rotary surface plates to efficiently and economically achieve high-quality double side polishing.

Double side polishing method and apparatus

A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works () integrally with the carriers () on the outside of a polishing device main body (), feeding the works () onto a rotating surface plate () on the underside of the polishing device main body () with the works formed integrally with the carriers (), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works () on the lower side rotating surface plate () after the double sides are polished, enabling the works () to be discharged automatically from the lower side rotating surface plate (), providing a brush storage part () and a dresser storage part () near the polishing device main body (), and frequently treating a polishing cloth installed on the opposed surfaces of the upper and lower rotating surface plates with a brush and a dresser.

In order to improve a flatness of a work in single wafer type double-side polishing in which one wafer is polished with one carrier, a carrier larger in diameter than upper and lower surface plates that rotate is inserted between the surface plates, and a wafer smaller in diameter than the surface plates is held with the carrier. The carrier is rotated by plural eccentric gears that mesh with external gear teeth formed on the outer peripheral surface of the carrier at plural positions along a circumferential direction thereof and revolve around positions spaced from the centers as centers in synchronism with each other or one another at the plural positions of meshing. The carrier rotates about its center and moves circularly around the center of the surface plates spaced from the center thereof. The upper surface plate is reciprocated in a direction perpendicular to the central axis when required. Geometrical motion loci of points on the wafer are complex and peripheral speeds alter to large extents to thereby enhance equalization of peripheral speeds of points on the wafer to a higher level to thereby improve a flatness.

Double-side polishing method and apparatus

An evaporating apparatus includes an evaporator (E) for converting a liquid into vapor and a preheater (2) for heating the liquid before it is fed to the evaporator (E). A pump (6) for feeding the liquid to the preheater (2) and another pump (8) for pressurizing the liquid passing from the preheater (2) to the evaporator (E) are provided, where the former maintains the liquid at a saturation pressure with respect to a temperature slightly higher than a saturation temperature (t.sub.o) at the preheater outlet, and the latter serves to raise the liquid pressure to a saturation pressure with respect to a desired evaporation temperature (t.sub.2). Rate of flow of a heating medium for the preheater (2) is controlled so that its temperature (t.sub.w3) is slightly higher than a liquid preheater outlet temperature (t.sub.ex). Thus, in the preheater (2), the liquid temperature (t.sub.ex) is maintained lower than saturation temperature (t.sub.o), ensuring a greater amount of heat transfer by subcool boiling.

Evaporating apparatus with preheater

A heat recovery system including a closed working fluid loop constituted by connecting an evaporating apparatus supplied with warm waste water, a steam turbine having an output shaft to be coupled to the load, and a condensing apparatus supplied with cooling water, works on the basis of a Rankine cycle and utilize non-azeotropic mixture as the working fluid.

Heat recovery system utilizing non-azeotropic medium

A heat recovery system including a closed working fluid loop constituted by connecting an evaporating apparatus supplied with warm waste water, a steam turbine having an output shaft to be coupled to the load, and a condensing apparatus supplied with cooling water, works on the basis of a Rankine cycle and is adapted to utilize a non-azeotropic mixture as the working fluid.

Heat recovery system utilizing non-azetotropic medium

A heat recovery system including a closed working fluid loop constituted by connecting an evaporating apparatus supplied with warm waste water, a steam turbine having an output shaft to be coupled to the load, and a condensing apparatus supplied with cooling water, works on the basis of a Rankine cycle and utilize a non-azeotropic mixture as the working fluid.

A heat recovering device comprising an oil injection type screw expander having its output shaft connected to a load, such as a generator, an evaporator using waste heat as a heat source to evaporate a working medium so as to produce working medium vapor to be fed to the expander, a condenser for condensing the working medium vapor discharged from the expander, a working medium circulating pump for circulating the working medium within a system comprised of the condenser, evaporator and expander, an oil circulating pump for feeding oil to the expander, and a heater for heating oil to be fed to the expander to a higher temperature than the working medium vapor temperature. The device is characterized in that the heated oil is injected into the expander in such a manner that the working medium vapor and the heated oil come in direct contact with each other in the expander, thereby superheating the working medium vapor.

Waste heat recovering device

A plate type evaporator comprising a plurality of vertically extending plate elements assembled face-to-face to define therebetween alternate channels for a heating medium and for a liquid to be evaporated. In order to accelerate the nuclear boiling of the liquid in the liquid channels, the heat transfer surface of each plate element has a plurality of vertically extending transversely spaced ridges projecting toward the associated liquid channel, such ridges being in contact with the heat transfer surface of the opposed plate element to provide areas of contact assisting in the evolution of vapor bubbles and divide the liquid channel into narrow sections assisting in the generation of vapor, such sections also assuring that even in deeper places in the liquid channel, vapor bubbles will be generated without yielding to the liquid pressure; alternatively, each plate element has a porous layer formed on its heat transfer surface facing the liquid channel. These heat transfer constructions permit attainment of even higher boiling heat transfer if the liquid in the liquid channels is caused to circulate.

Plate type evaporator

A plate type evaporator comprising a plurality of vertically extending plate elements assembled face-to-face to define therebetween alternate channels for a heating medium and for a liquid to be evaporated. The plate elements have porous layers formed on their opposed heat transfer surfaces functioning as the channels for the liquid to be evaporated. The porous layers are utilized as nuclear boiling accelerating members to improve the capability of evaporating liquid on the boiling heat transfer surfaces.

A structure of fluid condensing and heat conducting surface of the condenser characterized in that completely recessed grooves for collecting fluid are provided on said surface integrally therewith, wherein the distance between the centers of radii of rounded corners of said groove is made less than 3 mm.

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Osaka, Japan

Akira Horiguchi