Yazaki Corporation

Akira Harao

Minoru Kubota

Mototatsu Matsunaga

Yasuhiro Sugiura

Tomohiro Sugiura

Akinori Saneto

Yusuke Takagi

Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

Wiring substrate and manufacturing method thereof

A wiring substrateA includes a high heat radiation substratewhich has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surfacefor a variety of components; a connection terminalwhich is extended from the high heat radiation substrateand bent in a direction perpendicular to a surface of the high heat radiation substrate; and a heat radiation piece sectionwhich is integrally installed to the connection terminal

The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.

Wiring board and manufacturing method thereof

Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

A fuse connection unit includes a metal core substrate that includes a metal core plate and insulation layers formed on front and back faces of the metal core plate, and a fuse block mounted on the metal core substrate. The metal core substrate has a fuse connection terminal part which is projected from an end edge of each of the insulation layers. The fuse block has a fuse connection terminal. The fuse connection terminal part and the fuse connection terminal are configured to be connected to a fuse.

Fuse connection unit

A metal core substrate is provided. A first routing member is comprised of a first area of one sheet of metal core material; a first insulation layer formed on the first area; and a first circuit pattern made of a copper foil and formed on the first insulation layer. A second routing member comprised of: a second area of the one sheet of the metal core material, which is separated from the first area; a second insulation layer formed on the second area; and a second circuit pattern made of a copper foil and formed on the second insulation layer. A connecting member electrically connects the first routing member and the second routing member. The connecting member is comprised of a third area of the one sheet of the metal core material, which is interposed between the first area and the second area.

Growing community of inventors

Makinohara, Japan

Akira Harao