Ngk Insulators, Inc.

Ngk Optoceramics Co., Ltd.

Nck Insulators, Ltd.

Akira Hamajima

Jungo Kondo

Yuichi Iwata

Takashi Yoshino

Yuji Hori

Tomoyoshi Tai

Kenji Aoki

Shoichiro Yamaguchi

Tetsuya Ejiri

Osamu Mitomi

Shuhei Toyoda

Keiichiro Asai

Atsuo Kondo

Yukihisa Osugi

Naotake Okada

Yoshinari Kozuka

Shuhei Higashihara

Tetsuhisa Abe

Takenori Ichigi

Kengo Suzuki

Yoshizumi Nakasuji

Toshinao Nakahara

A phosphor element comprises: a support substrate; an optical waveguide for propagating an excitation light through the waveguide, the optical waveguide comprising a phosphor generating a fluorescence, and the optical waveguide comprising an emission side end surface emitting the excitation light and the fluorescence, an opposing end surface opposing the emission side end surface, a bottom surface, a top surface opposing the bottom surface and a pair of side surfaces; a bottom surface side clad layer covering the bottom surface of the optical waveguide; a top surface side clad layer covering the top surface of the optical waveguide; side surface side clad layers covering the side surfaces of the optical waveguide, respectively; a top surface side reflection film covering the top surface side clad layer; side surface side reflection films covering the side surface side clad layers, respectively; and a bottom surface side reflection film provided between the support substrate and the bottom surface side clad layer.

Phosphor element and illumination device

An acoustic wave device is an end surface reflection-type acoustic wave device and includes a substantially rectangular-parallelepiped composite substrate in which a piezoelectric substrate and a supporting substrate are joined together, with a pair of IDT electrodes provided on the substrate in such a manner as to be intercalated with each other. A chipping size in a first side face of the substrate is 1/10 of a wavelength &#x3bb; of an acoustic wave or smaller, the face extending orthogonally to a direction of acoustic-wave propagation. A chipping size in a second side face of the substrate is larger than the chipping size in the face and is, for example, &#xbd; of the wavelength &#x3bb; or larger and 50 times the wavelength &#x3bb; or smaller, the face extending in the direction of acoustic-wave propagation.

Acoustic wave device

A composite substrateincludes a piezoelectric substrateand a support layerbonded to the piezoelectric substrate. The support layeris made of a material having no crystalline anisotropy in a bonded surface thereof and has a smaller thickness than the piezoelectric substrate. The piezoelectric substrateand the support layerare bonded together with an adhesive layertherebetween. The composite substratehas a total thickness of 180 &#x3bc;m or less. The base thickness ratio Tr=t2/(t1+t2) is 0.1 to 0.4, where t1 is the thickness of the piezoelectric substrate, and t2 is the thickness of the support layer. The thickness t1 is 100 &#x3bc;m or less. The thickness t2 is 50 &#x3bc;m or less.

Composite substrate, piezoelectric device, and method for manufacturing composite substrate

A first main face of a substrate of a dielectric single crystal is etched to form recesses in the substrate. A second main face of the substrate is mechanically processed to form a slab, so that the recesses pass through the substrate to form through holes.

Method of producing a slab type two-dimensional photonic crystal structure

An optical modulatorhas a supporting substrate, a modulating substratemade of an electro-optical material, an optical waveguideprovided on the side of a first main surfaceof the modulating substrate, and an adhesion layeradhering a second main surfaceof the modulating substrateonto the supporting substrate. The modulating substratehas a high-frequency interaction portionapplying a voltage on the optical waveguideto modulate propagating light, an incident portioninputting light to the optical waveguide, and an outgoing portionoutputting light from the optical waveguide. The high-frequency interaction portionis recessed on the first main surfaceof the modulating substratewith respect to the incident and outgoing portionsand. The high-frequency interaction portionhas a thickness smaller than the those of the incident and outgoing portionsand

Optical modulators

In a piezoelectric thin film device of the present invention, the degree of flexibility is enhanced in selection of a piezoelectric material constituting a piezoelectric thin film and the crystal orientation in the piezoelectric thin film. A piezoelectric thin film filter, including four film bulk acoustic resonators, has a configuration where a filter section for providing a filter function of the piezoelectric thin film filter is bonded with a flat base substrate mechanically supporting the filter section via an adhesive layer. In manufacturing of the piezoelectric thin film filter, a piezoelectric thin film is obtained by performing removal processing on a piezoelectric substrate, but the piezoelectric thin film obtained by removal processing cannot independently stand up under its own weight. For this reason, a prescribed member including the piezoelectric substrate is previously bonded to the base substrate as a support prior to the removal processing.

Method of manufacturing a piezoelectric thin film device

A jig for producing optical parts comprises a base stand for stacking ten individuals of fiber coil reels around which optical fibers are wound in a predetermined number of turns respectively, and array-holding mechanisms provided on a circumferential surface of the base stand, for downwardly exposing respective end surfaces of arrays secured to ends of the plurality of optical fibers led from the respective stacked fiber coil reels. Accordingly, it is possible to highly accurately polish the end surfaces of the array members secured to the ends of the optical fibers led from the plurality of reels respectively. It is possible to eliminate almost all dispersion in polishing accuracy among the array members, and it is possible to produce the optical parts highly accurately with a good yield.

Jig for producing optical parts

An optical transmission member-fixed assembly including a substrate with a receipt groove in which a core wire of an optical transmission member is received, a lid integrated with the substrate, while between the substrate and the lid is provided a receipt space in which at least a covering of the optical transmission member is received, a dimension of the receipt space being greater than that of the receipt groove when viewed in a width direction, wherein an adhesive is filled around the core wire inside the receipt groove for fixing the core wire there, an adhesive is filled around the optical transmission member within the receipt space for fixing the optical transmission member there, a thickness of the adhesive filled around the optical transmission member inside a boundary space zone between the receipt space and the receipt groove is continuously reduced as a location of the boundary space zone is at least near and goes to an opening of the receipt groove at an end opposed to the receipt space.

Optical transmission member-fixed assembly

In a method of forming an assembly of an optical waveguide substrate and an optical fiber aligning substrate by adjoining an end face of a main body of the optical waveguide substrate and an end face of a main body of the optical fiber aligning substrate, a starting block formed by a flat rectangular plate is divided along a dividing surface which intersects perpendicularly to a side wall as well as a bottom wall of the starting block which are selected as a reference surface to obtain the main bodies of the optical waveguide substrate and optical fiber aligning substrate, optical waveguides are formed on the main body of the optical waveguide substrate by using the side wall and bottom wall as a positional reference, V-shaped guide grooves are formed in the main body of the optical fiber aligning substrate by using the side wall and bottom wall as a positional reference, and optical fibers are inserted into the guide grooves.

Growing community of inventors

Nagoya, Japan

Akira Hamajima