The Dow Chemical Company

Asahi Kasei Kogyo Kabushiki Kaisha

Akira Fujie

Minoru Hisamatsu

Nobuo Miura

Ichiro Ibuki

Tsukasa Yamagishi

There is disclosed expandable vinylidene chloride-based resin particles comprising 100 parts by weight of a non-crystalline vinylidene chloride-based resin composition and 1 to 40 parts by weight of a volatile organic blowing agent or a composition thereof, said resin composition consisting of

Expandable vinylidene chloride composition and foam therefrom

The present disclosure is directed to foam particles of a linear, uncrosslinked ethylenic resin which can be expansion molded by heating in its uncrosslinked state. The present disclosure is also concerned with a process for preparing foam particles of a linear uncrosslinked ethylenic resin and a process for the in-mold foam molding of said resin particles.

Preparation of foam particles of ethylenic resin and foam moldings

A foamable, electroconductive polyolefinic resin composition comprising 70 to 95 weight percent of a polyolefinic resin and 5 to 30 weight percent of an electrically-conductive particulate furnace black having a specific surface area of at least 900 square meters per gram. Foam products prepared from this composition, preferably by extrusion foaming, are particularly useful for packaging sensitive electronic parts.

Foamable electroconductive polyolefin resin compositions

Electroconductive olefin polymer foams which are suitable for use as packaging/cushioning materials for sensitive electronic parts are prepared from olefin polymer compositions which comprise a major proportion by weight of an olefin polymer, from 5 to 30 weight percent, based on said olefin polymer, of an electroconductive carbon black and from 0.1 to 10 weight percent, based on said olefin polymer of a saturated fatty acid amide compound.

Growing community of inventors

Suzuka, Japan

Akira Fujie