Hitachi Cable, Inc.

Renesas Electronics Corporation

Other

Nec Electronics Corporation

Akira Chinda

Nobuaki Miyamoto

Kenji Uchida

Koki Hirasawa

Mamoru Mita

Akira Matsuura

Takashi Kageyama

Katsutoshi Taga

Takayuki Yoshiwa

An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

Method for fabricating an electronic device substrate

A method of making an electronic device is disclosed. The method includes the steps of providing an electronic device substrate, mounting an electronic part on the electronic device substrate, removing the tape member and the metal film from the electronic device substrate, and forming a conductive structure at a position corresponding to the metal plating layer. The electronic device substrate includes a base material formed of a thin board and the base material includes a tape member, a metal film, a release layer, a metal layer, an electrical insulation layer and a metal plating layer filled in the plurality of openings.

Method of making an electronic device and electronic device substrate

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

A core substrate-less electronic device is fabricated by using an electronic device substrate. The electronic device substratea metal core substrate, and an external connection wiring layerprovided on the metal core substrate, and an electronic parts-mounting layerprovided on the external connection wiring layer. The external connection wiring layerhas a first plating filmas an external connection terminal, and a PSR filmas an electrical insulating material. The electronic parts-mounting layerhas a conductive filmas an internal conductor pattern and a PSR filmas an electrical insulating material. A surface of the conductive filmis in a same plane as a surface of the PSR film

Electronic device substrate, electronic device and methods for fabricating the same

An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.

Electronic device substrate, electronic device and methods for making same

On both surfaces of an electric insulating material, a surface conductive layerA and a back surface conductive layerB are formed by transcription. Further, a via holepenetrating through the surface conductive layerA and the electric insulating materialis provided. After forming a photosensitive plating resist pattern, the via holeis filled with a copper plating filler, and the surface wiring layerA and the back surface wiring layerB are formed. Thereafter, the photosensitive plating resist patternas well as the surface conductive layerA and the back surface conductive layerB provided under the photosensitive plating resist patternare removed to fabricate a double-sided wiring board

Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same

An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.

A method is provided for fabricating a double-sided wiring board for mounting an electronic component thereon having metal wiring patterns formed both on upper and lower sides of an electrically-insulating board. The metal wiring patterns are electrically connected each other through a through-hole and/or a blind via-hole. The method has the steps of: laminating a metal layer with a support substrate on at least one side of the electrically-insulating board; removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board; and forming the through-hole and/or the blind via-hole in the electrically-insulating board.

Method for fabricating double-sided wiring board

A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

Wiring board, method for manufacturing wiring board and electronic component using wiring board

A semiconductor device has: a wiring board that includes an insulating substrate and a wiring provided on the insulating substrate; a semiconductor chip that is mounted on the wiring board; an opening that is formed at a predetermined position in the insulating substrate, one end of the opening being shut by the wiring to form the bottom of the opening; a thin film conductor that is formed on the surface of the wiring and at the bottom of the opening; an embedded conductor layer that is provided in the opening while contacting the thin film conductor formed at the bottom of the opening; and an external connection terminal that is disposed at the other end of the opening to electrically connect with the wiring through the embedded conductor layer and the thin film conductor provided in the opening. The thin film conductor includes gold plating layer formed on the surface, the external connection terminal is of tin or an alloy including tin, and the embedded conductor layer is of a conductor that has a rate of solution to tin or an alloy including tin lower than that of gold.

Semiconductor device, wiring board and method of making same

In a writing board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principle plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.

Method of fabricating a wiring board utilizing a conductive member having a reduced thickness

In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.

Growing community of inventors

Hitachi, Japan

Akira Chinda