Nichia Corporation

Nichias Corporation

Akira Asano

Yohei Kawano

Kohei Shima

Ryosuke Wakaki

Hideki Kitahara

Takahito Mochida

A light-emitting device includes an optical member including first and second light emitting elements, first and second light condenser portions, and a light guide portion. The first light condenser portion is disposed at a position corresponding to the first light-emitting element, and condenses a portion of light emitted from the first light-emitting element. The second light condenser portion surrounds the first light condenser portion, and condenses a portion of the light that is not incident to the first light condenser portion among the light emitted from the first light-emitting element. The light guide portion is disposed at a periphery of the second light condenser portion and at a position corresponding to the second light-emitting element, and guides light emitted from the second light-emitting element by causing total reflection in an interior of the light guide portion. A full width at half maximum of light exiting from the light guide portion is larger than a full width at half maximum of light exiting from the first light condenser portion.

Light-emitting device, lighting device, and optical member

A backlight unit includes a light source, a light guide guiding light from the light source, an optical sheet disposed on the light guide, and an inner frame having an opening housing the optical sheet. A peripheral portion of the optical sheet includes a projection group respectively at each of the longitudinal sides that are among the constituent sides of an approximately rectangular external contour of the optical sheet. The projection group includes a first projection arranged in a projection insertion region provided in a side wall of the inner frame and a second projection arranged outside of the projection insertion region in the opening of the inner frame.

Backlight unit

Disclosed herein is a bio-soluble inorganic fiber with high tensile strength, manufactured in a method comprising: heating and melting a raw material which includes, on a weight basis, 60 to 80 percent of SiO, 5 to 20 percent of MgO, 5 to 30 percent of CaO, 0.5 to 5 of AlO, and 0.1 to 5 of BaO, at a temperature of 1800 to 2100 degrees Celsius; and exposing the melting material to an air flow for fiber forming.

Growing community of inventors

Tokushima, Japan

Akira Asano