Hd Microsystems, Ltd.

Akira Asada

Tetsuya Enomoto

Atsutaro Yoshizawa

Takashi Kawamori

Nobuyuki Saito

Masayuki Ohe

Satoshi Yoneda

Yukari Koibuchi

Etsuharu Tsuchiya

A photosensitive resin composition comprises a polyimide precursor having a polymerizable unsaturated bond; one or more compounds represented by any of the following formulas (1) to (4); and photopolymerization initiator represented by the following formula (11). In formulas (1) to (4), R, R, and Rare independently an alkyl group including 1 to 4 carbon atoms, and Rto Rare independently a hydrogen atom, or an alkyl group including 1 to 4 carbon atoms; and in the formula (11), Ris an alkyl or alkoxy group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; Ris an alkyl group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; and Ris a benzoyl group, a fluorenyl group, or a carbazolyl group.

Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component

A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component

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Hitachi, Japan

Akira Asada