Kawasaki Steel Corporation

Tokyo Gas Company Limited

Mitsubishi Denki Kabushiki Kaisha

Kawatetsu Techno-construction Co., Ltd.

Akira Adachi

Tomoya Fujimoto

Shigeru Morishita

Mitsutoshi Hayashi

Shingo Nagashima

Minoru Kurashina

Kenko Okamura

Kentaro Yoshida

Masaru Murakami

Akinari Fujita

Junji Fujino

Osamu Hayashi

Yoshiyuki Morihiro

Goro Izuta

Jitsuho Hirota

Mitsuhiro Nonogaki

Kohei Murakami

Toshikazu Masuda

Isamu Miyoshi

There is provided a double walled pipe having an inner pipe and an outer pipe which is movable relative to the inner pipe in a longitudinal direction of the inner pipe. Acting on only the outer pipe with a pipe jacking power makes it possible to bury the double walled pipe, without damaging the rear end of the inner pipe and also generating an internal stress on the inner pipe. Consequently, it is avoided such a situation that even in use pinholes, cracks, etc. occur on the inner pipe, and thus it is possible to expect an execution with higher reliability.

Double walled pipe, jacking method and pipe end structure of leading pipe

A method of depositing solder paste includes the steps of: superimposing a masking member having a plurality of through-holes and a supporting member on each other so that the supporting member covers the plurality of through-holes; filling cavity portions formed by the plurality of through-holes and the supporting member with solder paste; disposing an LSI chip and the masking member so that electrodes and the cavity portions are superimposed on each other respectively; and heating the solder paste so as to make the solder paste deposit on the electrodes.

Solder supplying method, solder supplying apparatus and soldering method

A buried pipe laying method of additionally coupling a new pipe with the extreme end of a buried pipe laid underground involves flatly deforming a cylindrical pipe having a pipe length smaller than the inside diameter of the buried pipe, conveying the deformed cylindrical pipe to the extreme end of the buried pipe laid underground through the interior thereof, and then returning the deformed shape of the cylindrical pipe to its original circular shape and coupling it with the extreme end of the buried pipe.

Buried pipe laying method

Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.

Flux for soldering and solder composition comprising the same and

Growing community of inventors

Chiba, Japan

Akira Adachi