Mitsubishi Paper Mills Limited

Mitsubishi Denki Kabushiki Kaisha

Toshiba Mitsubishi-electric Industrial Systems Corporation

Nippon Mektron Limited

Dainichiseika Color & Chemicals Mfg. Co., Ltd.

Isuzu Motors Limited

Kyoto University

Nec Corporation

Osaka University

Akio Yoshida

Yasuo Tsubai

Shigeru Sakamoto

Hiroyuki Orita

Takahiro Shirahata

Motozo Yamano

Akira Tanaka

Michiei Nakamura

Yoshinobu Tsuchiya

Ken Kurabayashi

Susumu Baba

Kenji Kawaguchi

Susumu Hoshinouchi

Hiromitsu Yanagimoto

Jun Urasaki

Hiroyuki Kurokawa

Shizuo Fujita

Hiroaki Saikatsu

Yoriaki Niida

Hideaki Baba

Akinobu Kawazu

Hitoshi Koizumi

Mitsunori Sasaki

Kazuhiko Ibaraki

Kozo Haino

Seigo Ebato

Takenobu Yoshiki

Koji Okazaki

Naoto Kamata

Hiroaki Tobuse

Masanori Takakamo

Keisuke Iguchi

Toshiyuki Kawaharamura

Yoshimasa Tsuchiya

Hiroyasu Hasegawa

Naoki Kameyama

Masahisa Kogura

Takao Arai

Hiroshi Kobayashi

Kenji Ogawa

Masayuki Iwase

Toshiro Kondo

Tsuyoshi Sekitani

Jun Yamada

Hidetoshi Miura

Shigeo Sasaki

Shigeyoshi Suzuki

Akira Kaneko

Takafumi Uemura

Hiroshi Nishinoiri

Masahiko Saikawa

Hideki Miura

Shusuke Yoshimoto

Takuji Oda

Naoyuki Sakai

Shoichi Horii

Teppei Araki

Taisuke Kimura

Yutaka Araki

Minoru Kobayashi

Kazuhisa Nakao

Ryoichi Toyoshima

Wataru Shimada

Tetsuo Fukuda

Satoshi Minami

Hiroyoshi Moroboshi

Mamoru Nakatani

Kiyoshi Igarashi

Yuji Takagami

Tomoyuki Kanda

Makiko Oko

Tatsunori Hibara

Tohru Hosoda

Hideyuki Koiso

Hideaki Ishiguro

Tomoyuki Nishinaka

Yoshitaka Toriumi

Toshiyasu Fujita

Masaaki Kinoshita

Tetsunobu Murakata

Dai Watanabe

Seishichi Sasaki

Shingo Muromoto

Hideo Kiyoyama

Shigeyuki Yonezawa

Susumu Hoshinoughi

Hiroyuki Ishikura

Tadakuni Nishitani

Tohoru Hosoda

Yasusi Hisaoka

Ryuji Ueda

Akihiko Yamasaki

Toshiaki Fukunishi

Tadayoshi Owaki

Enkichi Oura

Takashi Okada

Shuichi Odaka

Kazuhito Ooki

Yutaka Miura

Toshio Yamaguchi

A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.

Catheter flexible printed wiring board and method for manufacturing the same

Provided is an electrode sheet allowing easy connection of a wiring that is extended, when required, to a measurement position on a living body. The electrode sheet (main sheet (), auxiliary sheet ()) includes a sheet-shaped flexible substrate (), wirings () formed on the flexible substrate (), electrodes () formed on the flexible substrate () and electrically connected to the wirings (), and an insulating layer () laid on the flexible substrate () in such a manner that the wirings () are overlaid with the insulating layer () while the electrodes () are exposed. The electrodes () are formed of a conductive material in which conductive particles are dispersed in a thermoplastic resin.

Electrode sheet

A receiver includes a stretchable circuit board having stretchability and a first antenna formed on a main surface of the stretchable circuit board, the first antenna being configured to stretch in accordance with the stretchable circuit board and configured to receive a signal transmitted from a transmitter installed in a living body.

Receiver and receiving system

An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion () of an ultrasonic bonding tool () used in an ultrasonic bonding apparatus has a plurality of planar portions () formed so as to be separated from one another, and a plurality of concavities () formed between the plurality of planar portions. Each of the plurality of planar portions () has a flatness of 2 &#x3bc;m or less.

Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus

An attachment tag includes a stretchable circuit board having stretchability, a stretchable wiring line provided on a first main surface of the stretchable circuit board and having stretchability, an identification signal generator connected to the stretchable wiring line and configured to generate an identification signal containing identification information, a transmitter configured to transmit the identification signal generated by the identification signal generator, and an adhesive layer provided on a second main surface, different from the first main surface, of the stretchable circuit board and exhibiting adhesiveness.

Attachment tag and tag system

A wetting sensor includes a stretchable circuit board having stretchability, a first stretchable wiring line as a wiring line formed on a main surface of the stretchable circuit board and having stretchability on the main surface, a second stretchable wiring line as a wiring line formed on the main surface of the stretchable circuit board and having stretchability on the main surface, a first electrode connected to the first stretchable wiring line, a second electrode connected to the second stretchable wiring line, a water absorbing member configured to cover at least a part of each of the first electrode and the second electrode, and a measurer configured to measure an electric characteristic between the first electrode and the second electrode which are contacting the water absorbing member.

Wetting sensor and wetting sensing system

An extensible flexible printed circuit board sets one or a plurality of flexible printed circuit boards each including a plurality of conductive layers and an insulating layer as a base circuit board, and includes: component mounting parts which are provided at least at parts of the base circuit board, and capable of mounting electronic components; an extensible conductive part which is provided at least at a part of the base circuit board, includes a plurality of joint parts each intersecting a center line in an extension/contraction direction and a plurality of curved parts each continuing from an end part of each joint part and curve, and exhibits extensibility by the curved parts curving to open or close; and a covering member whose material is a flexibly deformable elastomer, and which covers the component mounting parts and the extensible conductive part.

Extensible flexible printed circuit board and method for manufacturing extensible flexible printed circuit board

The present invention includes a mist generator that generates a mist of a raw material of a film to be formed, and a mist jet nozzle that jets the mist generated by the mist generator to a substrate on which a film is to be formed. The mist jet nozzle includes: a main body having a hollow portion; a mist supply port that supplies the mist; a spout that jets the mist to the outside; a carrier gas supply port that supplies a carrier gas; and a shower plate having a plurality of holes formed therein. By the arrangement of the shower plate, the hollow portion is divided into a first space connected to the carrier gas supply port and a second space connected to the spout. The mist supply port is connected to the second space.

Film formation device

A method of forming a zinc oxide film or a magnesium zinc oxide film which has a high transmittance. The method of forming a zinc oxide film or a magnesium zinc oxide film includes (A) converting a solution containing zinc, or zinc and magnesium into mist, (B) heating a substrate, and (C) supplying the solution converted into mist, and ozone to a first main surface of the substrate under heating.

Method of forming zinc oxide film (ZnO) or magnesium zinc oxide film (ZnMgO) and apparatus for forming zinc oxide film or magnesium zinc oxide film

The present method of forming a metal oxide film can increase production efficiency while maintaining the low resistance of the metal oxide film. The present method of forming a metal oxide film includes first misting a solution containing a metallic element and ethylenediamine; meanwhile, heating a substrate; and then, supplying the misted solution onto a first main surface of the substrate.

Method for forming metal oxide film, metal oxide film and apparatus for forming metal oxide film

A film forming apparatus includes a first solution container, a second solution container, a reaction chamber, a first path, and a second path. The first solution container stores a source solution containing metal. The second solution container stores hydrogen peroxide. A substrate is in the reaction chamber, and the reaction chamber includes a heating unit that heats the substrate. The first path supplies a source solution from the first solution container to the reaction chamber. The second path supplies hydrogen peroxide from the second solution container to the reaction chamber.

Apparatus for forming metal oxide film, method for forming metal oxide film, and metal oxide film

The present invention aims at providing a method for forming a metal oxide film which can further improve the production efficiency while maintaining low resistance of a metal oxide film formed thereby. In the method for forming a metal oxide film of the present invention, a solution () containing a metallic element and ammonia () is formed into a mist. Meanwhile, a substrate () is heated. Then, the solution () formed into a mist is supplied onto a first main surface of the substrate () being heated.

Method for forming metal oxide film, metal oxide film, and apparatus for forming metal oxide film

A lead wire pull-out apparatus includes: a lead reel configured to have a lead wire wound thereon; two fixed lead bearings fixed at predetermined positions, on which the lead wire pulled out from the lead reel is slidable; a movable lead bearing arranged between the two fixed lead bearings, the movable lead bearing being movable in a vertical direction and configured such that a lower portion thereof is able to be in contact with the lead wire; and a press-down part configured to press down the movable lead bearing.

Lead wire pull-out apparatus

An aqueous pigment dispersion is produced by ultrafinely dispersing a pigment dispersion mixture, which has been obtained by mixing at least a pigment and a dispersant in an aqueous medium, with microbeads having diameters of not smaller than 0.02 mm but smaller than 0.2 mm. A color composition for a color filter is produced by dispersing a mixture of a pigment, a dispersant, a resin varnish and a solvent with the microbeads in a mill.

Water-based pigment dispersions, inkjet recording inks, and color filters

A dispersant for an organic pigment contains a compound represented by the following formula (1): wherein Rand Rmay be the same or different and each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a primary, secondary or tertiary amino group, an alkyl group, a substituted or unsubstituted aryl group or a substituted or unsubstituted phthalimidomethyl group, Rand Rmay be the same or different and each independently represents a hydrogen atom or a lower alkyl group, and n means an average number of introduced sulfonic groups and stands for a number of from 0.5 to 3; or at least one salt selected from the group consisting of its metal salt, ammonium salt, organic amine salt, and organic quaternary ammonium salt. Also disclosed are a readily-dispersing pigment composition, a pigment dispersion, a colored coating fluid for color filters, a fabrication process of a color filter and a color filter, all of which make use of the dispersant.

Dispersants for organic pigments

Growing community of inventors

Tokyo, Japan

Akio Yoshida