Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Hitachi Automotive Systems, Ltd.

Other

Hitachi, Ltd. and Hitachi Car Engineering Co., Ltd.

Akio Yasukawa

Keiji Hanzawa

Hirohisa Yamamura

Osamu Suzuki

Satoshi Shimada

Rintaro Minamitani

Masahiro Matsumoto

Shinya Igarashi

Naoki Saito

Hiromu Kikawa

Masayuki Kozawa

Masamichi Yamada

Atsushi Miyazaki

Junichi Horie

Motohisa Nishihara

Norio Ichikawa

Masanori Tanabe

Akira Takasago

Akihiko Saito

Tatsuya Shigemura

Seiji Kuryu

Tatsuji Sakamoto

Hideo Miura

Hiroshi Nakano

Takahiro Miki

Noboru Sugiura

Takeshi Morino

Izumi Watanabe

Yutaka Watanabe

Fumiyuki Kobayashi

Shotaro Naito

Noriaki Yamamoto

Hiroshi Moriya

Akira Koide

Seikou Suzuki

Heikichi Kuwahara

Yasuo Onose

Tomokatsu Oguro

Mitsuyuki Hombu

Gyozo Toda

Yukinori Taneda

Kaname Sasaki

Ko Soeno

Yuki Okamoto

Shizuhisa Watanabe

Nobunori Matsudaira

Makoto Iida

Shigeo Kuroda

Takashi Kuroki

Shosaku Ishihara

Masatoshi Tsuchiya

Takeo Nagata

Masao Sekibata

Hideyuki Nemoto

Hiroaki Doi

Heikichi Kuwabara

Masanori Muso

Nobuo Fujieda

Kenya Kawano

Sanshirou Obara

Mari Hikota

Shigejiro Sekine

Akira c/o Hitachi Ltd Int Prop Group Takasago

Masayuki Bouda Apart 3-312 Kozawa

Shinya 752-2 Konosu Naka-Machi Igarashi

Naoki 174-92 Suwama Tokai-Mura Saito

Hiromu 1210-73 Tabiko Kikawa

A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.

Thermal humidity sensor

In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.

Air flow meter

An air flow measuring instrument, comprising: an auxiliary passagearranged inside a main passage through which fluid flows, a tabular memberon which a pattern of a heating resistor for measuring an air flow is provided on one face, the tabular member being disposed inside the auxiliary passage so that the one faceon which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage, a heating resistor pattern-side fluid passageportion formed so that the fluid flows between the faceand a passage-forming surfaceof the auxiliary passage, and a back-surfaceside fluid passage portion formed so that fluid flows between a faceon a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portionguiding dust that collides against the end portion to back-surface side fluid passage portionside is provided on upstream-side end of tabular member.

Air flow measuring instrument having dust particle diverting structure

A heating resistor type flow measuring device comprising a housing having a support part provided between a frame body and a connector and connected to the mounting part of a fluid passage, a flow rate detection element held on the frame body side of the housing, and an electronic circuit held on the housing and connected electrically to the flow rate detection element and the connector, wherein the electronic circuit is held on the frame body side of the housing and positioned in the fluid passage, a member with the rigidity higher than the material of the main structural member of the housing is formed integrally with the support part, the housing is fixed to the fluid passage through the member with high rigidity. A metal plate is inserted into the support part so as to increase rigidity. Further, a distance is provided between the support part and a metal plate forming a route for conducting the heat transferred to the metal base fixing an electronic circuit substrate by a plastic mold so as to form a structure obstructing a heat transfer, or a clearance is provided in a portion spaced by the plastic mold between the support part and the metal base so as to form a structure obstructing a heat transfer.

Heating resistor type flow measuring device housing structure having projection and recess for preventing mis-installation

An air flow rate measuring device is provided in which a pressure loss across a grid therein due to the load which is generated when a hose band is tightened is reduced and deterioration of its measurement accuracy due to the grid deformation is prevented. The grid is configured to have a grid portion which absorbs deformation at the outer periphery thereof, and another grid portion which does not absorb deformation at the inner periphery thereof. In order to make the grid portions independent of each other, the grid is provided with a frame, and the mesh grid inside of the frame which maintains a rectifying effect, prevents the deterioration of the measurement accuracy, and does not absorb deformation, and the grid outside of the frame absorbs deformation.

Air flow rate measuring device

The invention provides a thermal type flow meter which has a high reliability and a low cost. In a thermal type flow meter provided with a flow rate detecting element in which at least a heat generating resistor and a lead electrode are formed on a surface of a tabular substrate, and a support body in which a concave portion accommodating the flow rate detecting element is formed on a surface, and in which the flow rate detecting element is firmly fixed and accommodated by an adhesive agent in a back surface of the tabular substrate and a part of a bottom surface of the concave portion, an approximately straight discharge groove which is deeper than a bottom surface of the concave portion and passes through both end surfaces in upward and downward sides of the concave portion is formed from the upstream side of the support body concave portion to the downstream side, between the cavity of the tabular substrate and the back surface region of the tabular substrate in which the lead electrode is formed. Accordingly, it is possible to achieve the thermal type flow meter which has the high reliability and the low cost.

Thermal type gas flow meter

Heating resistor type flow measuring device

By sealing a diaphragm with less processes and lower cost and reducing deformation due to remaining stress, a stable and highly reliable pressure sensor construction is proposed. The pressure sensor is low in measurement error and small in floating capacitance and leakage current and good in characteristic. As a means to attain the above object, a polycrystalline silicon diaphragm is sealed with a silicon oxide film deposited through a LPCVD method and then completely covered. The diaphragm is placed on a surface of a semiconductor substrate with a nearly constant gap of 0.15 to 1.3 &#x3bc;m, and has difference-in-grade constructions of a deformation reducing means due to remaining stress.

Capacitive type pressure sensor

Heated type air flow rate sensor and its forming method

A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and lead from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inside or outside the second seal.

Power inverter

A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.

Semiconductor device

A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.

Wire bonding method and apparatus and semiconductor device

A resin sealed semiconductor device is provided with an organic resin wiring substrate, an LSI chip having a semiconductor integrated circuit and mounted in a bare chip package form to the organic resin wiring substrate through a plurality of electrical bonding members, and a resin charged into a gap portion between the organic resin wiring substrate and the LSI chip. In this resin sealed semiconductor device, a modulus of longitudinal elasticity of the resin to be charged, its coefficient of linear thermal expansion and its fillet shape are optimized. The resin charged is also preferably colored in black to minimize adverse effects of visible rags on the LSI chip.

Resin sealed semiconductor device having improved arrangement for reducing thermal stress within the device

In a capacitance type pressure sensor, a diaphragm is formed of a fragile material using an impurity-diffused monocrystal silicon and constitutes a stable pressure-responsive structure which does not undergo a plastic deformation. Between the diaphragm and a movable electrode is formed an oxide film to diminish stray capacitance between the movable electrode and a substrate and also between the movable electrode and a impurity-diffused layer. The oxide film and the movable electrode are each divided into plural regions so that the divided regions of the movable electrode are formed on the divided regions of the oxide film, thereby diminishing stress strain induced by a difference in therm expansion coefficient among the diaphragm, oxide film and movable electrode. The upper surface of a fixed electrode is covered with a structure for the fixed electrode which structure is formed by an insulating polycrystal silicon film not doped with impurity whereby the rigidity of the electrode is enhanced and it is possible to diminish a leak current.

Capacitance type pressure sensor with capacitive elements actuated by a diaphragm

IGBT modules, bus bars and capacitors in an inverter main circuit are secured on the front face of a heat sink and at the back side of the heat sink a water cooling channel is formed to cool the IGBT modules. The bus bars and the capacitor, thereby the size of an inverter device used in an electric car is reduced and the duration thereof is prolonged.

Inverter device with cooling arrangement therefor

Growing community of inventors

Kashiwa, Japan

Akio Yasukawa